Inventor · disambiguated record
Soo-San Park
Also filed as: PARK SOO-SAN
32 granted patents·3 pending applications·215 citations·filing 2005–2012
96Inventor score
Top patents by PatentIndex Score
35 records- 0194US7923290B2Integrated circuit packaging system having dual sided connection and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Apr 12, 2011·35 cites·13 claims
- 0289US8273607B2Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereofPARK SOO-SAN·Filed 2010·Granted Sep 25, 2012·11 cites·16 claims
- 0389US8115293B2Integrated circuit packaging system with interconnect and method of manufacture thereofMOON DONGSOO·Filed 2009·Granted Feb 14, 2012·26 cites·20 claims
- 0489US7659609B2Integrated circuit package-in-package system with carrier interposerSTATS CHIPPAC LTD·Filed 2007·Granted Feb 9, 2010·19 cites·18 claims
- 0589US7238258B2System for peeling semiconductor chips from tapeSTATS CHIPPAC LTD·Filed 2005·Granted Jul 3, 2007·21 cites·16 claims
- 0687US7456088B2Integrated circuit package system including stacked dieSTATS CHIPPAC LTD·Filed 2006·Granted Nov 25, 2008·13 cites·10 claims
- 0786US7652376B2Integrated circuit package system including stacked dieSTATS CHIPPAC LTD·Filed 2008·Granted Jan 26, 2010·11 cites·9 claims
- 0884US7872340B2Integrated circuit package system employing an offset stacked configurationSTATS CHIPPAC LTD·Filed 2008·Granted Jan 18, 2011·10 cites·18 claims
- 0982US8247893B2Mountable integrated circuit package system with intra-stack encapsulationKIM YOUNGJOON·Filed 2007·Granted Aug 21, 2012·11 cites·20 claims
- 1080US8692388B2Integrated circuit package system with waferscale spacerLEE SANG-HO·Filed 2012·Granted Apr 8, 2014·4 cites·9 claims
- 1180US8559185B2Integrated circuit package system with stackable devices and a method of manufacture thereofLEE SANG-HO·Filed 2012·Granted Oct 15, 2013·4 cites·20 claims
- 1279US8383458B2Integrated circuit package system employing an offset stacked configuration and method for manufacturing thereofSTATS CHIPPAC LTD·Filed 2010·Granted Feb 26, 2013·4 cites·15 claims
- 1378US8810018B2Stacked integrated circuit package system with face to face stack configurationHA JONG-WOO·Filed 2006·Granted Aug 19, 2014·8 cites·10 claims
- 1478US8189344B2Integrated circuit package system for stackable devicesLEE SANG-HO·Filed 2008·Granted May 29, 2012·6 cites·18 claims
- 1577US7687919B2Integrated circuit package system with arched pedestalSTATS CHIPPAC LTD·Filed 2006·Granted Mar 30, 2010·7 cites·20 claims
- 1672US7829986B2Integrated circuit package system with net spacerSTATS CHIPPAC LTD·Filed 2006·Granted Nov 9, 2010·5 cites·20 claims
- 1770US8039365B2Integrated circuit package system including wafer level spacerSTATS CHIPPAC LTD·Filed 2006·Granted Oct 18, 2011·4 cites·19 claims
- 1869US8004073B2Integrated circuit packaging system with interposer and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Aug 23, 2011·4 cites·18 claims
- 1966US7968995B2Integrated circuit packaging system with package-on-package and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Jun 28, 2011·3 cites·20 claims
- 2065US8102666B2Integrated circuit package systemPARK HYUNGSANG·Filed 2008·Granted Jan 24, 2012·3 cites·10 claims
- 2164US7812435B2Integrated circuit package-in-package system with side-by-side and offset stackingSTATS CHIPPAC LTD·Filed 2007·Granted Oct 12, 2010·2 cites·17 claims
- 2261US8685797B2Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereofPARK SOO-SAN·Filed 2012·Granted Apr 1, 2014·1 cites·4 claims
- 2360US8906740B2Integrated circuit packaging system having dual sided connection and method of manufacture thereofKO CHAN HOON·Filed 2011·Granted Dec 9, 2014·1 cites·20 claims
- 2459US8067307B2Integrated circuit package system for stackable devicesCHOI DAESIK·Filed 2008·Granted Nov 29, 2011·1 cites·20 claims
- 2556US8067828B2System for solder ball inner stacking module connectionKO CHAN HOON·Filed 2008·Granted Nov 29, 2011·1 cites·20 claims
- 2652US8390110B2Integrated circuit packaging system with cavity and method of manufacture thereofLEE SANG-HO·Filed 2009·Granted Mar 5, 2013·0 cites·20 claims
- 2750US8211749B2Integrated circuit package system with waferscale spacerLEE SANG-HO·Filed 2006·Granted Jul 3, 2012·0 cites·10 claims
- 2850US7763145B2System for removal of an integrated circuit from a mount materialSTATS CHIPPAC LTD·Filed 2006·Granted Jul 27, 2010·0 cites·18 claims
- 2947US8093727B2Integrated circuit package-in-package system with side-by-side and offset stacking and method for manufacturing thereofPARK SOO-SAN·Filed 2010·Granted Jan 10, 2012·0 cites·17 claims
- 3044US2009152740A1Integrated circuit package system with flip chipPARK SOO-SAN·Filed 2007·Application pending·0 cites
- 3143US2009140408A1Integrated circuit package-on-package system with stacking via interconnectLEE TAEWOO·Filed 2007·Application pending·0 cites
- 3242US8581380B2Integrated circuit packaging system with ultra-thin diePARK SOO-SAN·Filed 2006·Granted Nov 12, 2013·0 cites·16 claims
- 3342US2009001549A1Integrated circuit package system with symmetric packagingPARK SOO-SAN·Filed 2007·Application pending·0 cites
- 3439US8692365B2Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereofMOON DONGSOO·Filed 2011·Granted Apr 8, 2014·0 cites·10 claims
- 3537US7863761B2Integrated circuit package system with molding ventsSTATS CHIPPAC LTD·Filed 2007·Granted Jan 4, 2011·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →