Inventor · disambiguated record
Dean Zehnder
Also filed as: ZEHNDER DEAN · ZEHNDER DEAN ALAN
8 granted patents·1 pending application·51 citations·filing 2004–2025
85Inventor score
Files withAMKOR TECHNOLOGY INC4AMKOR TECH SINGAPORE HOLDING PTE LTD2UNITIVE INT LTD2NANGALIA SUNDEEP NAND1
Top patents by PatentIndex Score
9 records- 0191US10304697B2Electronic device with top side pin array and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted May 28, 2019·6 cites·19 claims
- 0284US9245862B1Electronic component package fabrication method and structureAMKOR TECHNOLOGY INC·Filed 2013·Granted Jan 26, 2016·10 cites·20 claims
- 0383US9875980B2Copper pillar sidewall protectionAMKOR TECHNOLOGY INC·Filed 2014·Granted Jan 23, 2018·6 cites·15 claims
- 0479US8664090B1Electronic component package fabrication methodNANGALIA SUNDEEP NAND·Filed 2012·Granted Mar 4, 2014·6 cites·19 claims
- 0577US10832921B2Electronic device with top side pin array and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2019·Granted Nov 10, 2020·1 cites·20 claims
- 0675US2025167007A1Electronic device with top side pin array and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 0770US12205827B2Electronic device with top side pin array and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jan 21, 2025·0 cites·20 claims
- 0869US7550849B2Conductive structures including titanium-tungsten base layersUNITIVE INT LTD·Filed 2007·Granted Jun 23, 2009·5 cites·34 claims
- 0968US7244671B2Methods of forming conductive structures including titanium-tungsten base layers and related structuresUNITIVE INT LTD·Filed 2004·Granted Jul 17, 2007·17 cites·42 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →