Inventor · disambiguated record
Yoshiyuki Ohkura
Also filed as: OHKURA YOSHIYUKI
10 granted patents·7 pending applications·619 citations·filing 1994–2015
91Inventor score
Files withFUJITSU LTD103M INNOVATIVE PROPERTIES CO2OHKURA YOSHIYUKI2FUJITSU SEMICONDUCTOR LTD1KAWATE KOHICHIRO1
Top patents by PatentIndex Score
17 records- 0195US5602060AProcess for the production of semiconductor devicesFUJITSU LTD·Filed 1996·Granted Feb 11, 1997·479 cites·10 claims
- 0281US6218318B1Semiconductor device having a porous insulation filmFUJITSU LTD·Filed 1998·Granted Apr 17, 2001·70 cites·9 claims
- 0372US7749897B2Method of manufacturing semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Jul 6, 2010·5 cites·4 claims
- 0471US8716148B2Semiconductor device manufacturing methodOHKURA YOSHIYUKI·Filed 2011·Granted May 6, 2014·3 cites·19 claims
- 0569US7041586B2Semiconductor device having a multilayer interconnection structureFUJITSU LTD·Filed 2002·Granted May 9, 2006·13 cites·14 claims
- 0653US6417116B2Semiconductor device having a multilayer interconnection structureFUJITSU LTD·Filed 1999·Granted Jul 9, 2002·16 cites·13 claims
- 0749US2007200235A1Semiconductor device having reinforced low-k insulating film and its manufacture methodFUJITSU LTD·Filed 2006·Application pending·0 cites
- 0847US2007123035A1Method of manufacturing semiconductor deviceFUJITSU LTD·Filed 2006·Application pending·0 cites
- 0946US5691237AMethod for fabricating semiconductor deviceFUJITSU LTD·Filed 1995·Granted Nov 25, 1997·12 cites·13 claims
- 1044US8772182B2Semiconductor device having reinforced low-k insulating film and its manufacture methodOHKURA YOSHIYUKI·Filed 2010·Granted Jul 8, 2014·0 cites·10 claims
- 1144US2007246158A1Wiring board, production process thereof and connection method using same3M INNOVATIVE PROPERTIES CO·Filed 2006·Application pending·0 cites
- 1243US2010051324A1Dielectric substrate with holes and method of manufactureLEE VINCENT YONG CHIN·Filed 2006·Application pending·0 cites
- 1342US5976703AMaterial and method for planarization of substrateFUJITSU LTD·Filed 1996·Granted Nov 2, 1999·14 cites·14 claims
- 1441US2006205193A1Method for forming SiC-based film and method for fabricating semiconductor deviceFUJITSU LTD·Filed 2005·Application pending·0 cites
- 1539US2017292212A1Method for Manufacturing Metal Staple Fibers and Apparatus for Manufacturing Metal Staple Fibers3M INNOVATIVE PROPERTIES CO·Filed 2015·Application pending·0 cites
- 1637US5448111ASemiconductor device and method for fabricating the sameFUJITSU LTD·Filed 1994·Granted Sep 5, 1995·7 cites·6 claims
- 1736US2009321015A1Adhesive composition comprising polyhydroxyether and organic particles, and method for connecting circuit board using the sameKAWATE KOHICHIRO·Filed 2007·Application pending·0 cites
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