Inventor · disambiguated record
Koji Bando
Also filed as: BANDO KOJI
31 granted patents·9 pending applications·357 citations·filing 1991–2024
97Inventor score
Files withRENESAS ELECTRONICS CORP14FUJI XEROX CO LTD12RENESAS TECH CORP6BANDO KOJI2MITSUBISHI ELECTRIC CORP2
Top patents by PatentIndex Score
40 records- 0196US7580655B2Charging roller, electrophotographic process cartridge, and image forming apparatusFUJI XEROX CO LTD·Filed 2007·Granted Aug 25, 2009·26 cites·20 claims
- 0293US6545365B2Resin-sealed chip stack type semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Apr 8, 2003·114 cites·4 claims
- 0387US10566258B2Method of packaging power semiconductor module including power transistorsRENESAS ELECTRONICS CORP·Filed 2018·Granted Feb 18, 2020·5 cites·14 claims
- 0487US6730855B2Electronic elementRENESAS TECH CORP·Filed 2003·Granted May 4, 2004·44 cites·13 claims
- 0586US6773857B2Electrophotographic photoreceptor, processes for producing the same, process cartridge, and electrophotographic apparatusFUJI XEROX CO LTD·Filed 2002·Granted Aug 10, 2004·28 cites·18 claims
- 0685US8652880B2Semiconductor device and method of manufacturing sameBANDO KOJI·Filed 2012·Granted Feb 18, 2014·8 cites·3 claims
- 0784US9641102B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted May 2, 2017·5 cites·18 claims
- 0882US8258604B2Semiconductor device and method of manufacturing sameBANDO KOJI·Filed 2009·Granted Sep 4, 2012·10 cites·11 claims
- 0981US9530723B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2015·Granted Dec 27, 2016·3 cites·15 claims
- 1081US7622799B2Semiconductor device, interposer chip and manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Nov 24, 2009·12 cites·2 claims
- 1178US9906165B2Semiconductor moduleRENESAS ELECTRONICS CORP·Filed 2016·Granted Feb 27, 2018·3 cites·16 claims
- 1274US10361174B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Jul 23, 2019·2 cites·20 claims
- 1373US10284109B2Power module having control substrate mounted above power substrate with control substrate drivers located between the power substrate power transistorsRENESAS ELECTRONICS CORP·Filed 2018·Granted May 7, 2019·2 cites·11 claims
- 1473US5252422AMethod for preparing an electrophotographic photoreceptorFUJI XEROX CO LTD·Filed 1992·Granted Oct 12, 1993·20 cites·1 claims
- 1572US6876371B2Image forming apparatusFUJI XEROX CO LTD·Filed 2003·Granted Apr 5, 2005·13 cites·20 claims
- 1670US10056309B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Aug 21, 2018·1 cites·18 claims
- 1770US10050007B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Aug 14, 2018·1 cites·20 claims
- 1869US5188916AElectrophotographic photoreceptor having a zirconium and silicon-containing underlayerFUJI XEROX CO LTD·Filed 1991·Granted Feb 23, 1993·17 cites·4 claims
- 1963US7763406B2Electrophotographic photoreceptor, process cartidge and electrophotographic apparatusFUJI XEROX CO LTD·Filed 2005·Granted Jul 27, 2010·2 cites·16 claims
- 2063US7009304B2Resin-sealed semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Mar 7, 2006·9 cites·5 claims
- 2163US6661091B1Semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Dec 9, 2003·10 cites·8 claims
- 2262US6802048B2Design support apparatus and method for designing semiconductor packagesRENESAS TECH CORP·Filed 2002·Granted Oct 5, 2004·10 cites·20 claims
- 2359US6835520B2Apparatus for forming imageFUJI XEROX CO LTD·Filed 2002·Granted Dec 28, 2004·7 cites·12 claims
- 2458US11037847B2Method of manufacturing semiconductor module and semiconductor moduleRENESAS ELECTRONICS CORP·Filed 2020·Granted Jun 15, 2021·0 cites·3 claims
- 2558US2025174505A1Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2024·Application pending·0 cites
- 2653US10177110B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Jan 8, 2019·0 cites·7 claims
- 2752US2018331002A1Electronic deviceRENESAS ELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 2849US10141248B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2016·Granted Nov 27, 2018·0 cites·11 claims
- 2947US2023145328A1Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2022·Application pending·0 cites
- 3047US2018138828A1Semiconductor moduleRENESAS ELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 3142US8655220B2Electrophotographic photoreceptor, process cartridge and image forming apparatusIWASAKI MASAHIRO·Filed 2008·Granted Feb 18, 2014·0 cites·14 claims
- 3242US8268521B2Electrophotographic photoreceptor, process cartridge, and image forming apparatusNUKADA KATSUMI·Filed 2009·Granted Sep 18, 2012·0 cites·9 claims
- 3342US8021810B2Image carrier, process cartridge and image-forming apparatusFUJI XEROX CO LTD·Filed 2007·Granted Sep 20, 2011·0 cites·7 claims
- 3440US2013288170A1Electrophotographic photoreceptor, process cartridge, and image forming apparatusFUJI XEROX CO LTD·Filed 2012·Application pending·0 cites
- 3539US2003201546A1Resin-sealed semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2003·Application pending·0 cites
- 3638US5324606AElectrophotographic photoreceptorFUJI XEROX CO LTD·Filed 1992·Granted Jun 28, 1994·4 cites·9 claims
- 3737US2004159925A1Semiconductor device and method for manufacture thereofRENESAS TECH CORP·Filed 2003·Application pending·0 cites
- 3835US2011171570A1Electrophotographic photoreceptor, method of producing same, process cartridge, and image forming apparatusFUJI XEROX CO LTD·Filed 2010·Application pending·0 cites
- 3935US2016064312A1Manufacturing method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 4030US5403688AMethod for determining termination time of the step of dispersing a coating composition for photosensitive layer of electrophotographic photoreceptor and electrophotographic photoreceptor prepared using the dispersionFUJI XEROX CO LTD·Filed 1991·Granted Apr 4, 1995·1 cites·9 claims
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