Inventor

WEI WEN-HSIN

TW39 patents

⚠️ This page may combine multiple inventors who share the name “WEI WEN-HSIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WEI WEN-HSIN

TAIWAN SEMICONDUCTOR MFG CO LTD

Package structures and methods of forming the same

Structure and formation method for chip package

Chip package having die structures of different heights and method of forming same

Chip package having die structures of different heights

Stacked integrated circuit structure and method of forming

Package structures and methods of forming the same

Chip package having die structures of different heights and method of forming same

Giga interposer integration through chip-on-wafer-on-substrate

Package structure and method and equipment for forming the same

Package structures and methods of forming the same

3D packages and methods for forming the same

Package structure including through via structures

Package structure and method and equipment for forming the same

Package structure and method of fabricating the same

Package structure having line connected via portions

Stacked integrated circuit structure and method of forming

Forming large chips through stitching

Method of forming a dummy die of an integrated circuit having an embedded annular structure

Semiconductor device and method of manufacture

Chip package having die structures of different heights and method of forming same

Stacked integrated circuit structure and method of forming

Package structure having line connected via portions

Integrated circuit package and method of forming same

Forming large chips through stitching

Package structure and method and equipment for forming the same

Integrated circuit package and method of forming same

Giga interposer integration through Chip-On-Wafer-On-Substrate

Forming large chips through stitching

Semiconductor device and method of manufacture

Package structure and method of fabricating the same

Package structures and methods of forming the same

3D packages and methods for forming the same

Forming large chips through stitching

Formation method of chip package

Semiconductor device having heat dissipation structure of curved profile and a manufacturing method thereof

Integrated chip package including a crack-resistant lid structure and methods of forming the same

TAIWAN SEMICONDUCTOR MFG

3D packages and methods for forming the same

3D packages and methods for forming the same

SU CHIH-WEI

System and method of measuring heterogeneous network mobile communication apparatus and recording medium thereof