Inventor · disambiguated record
Brian S. Jarrett
Also filed as: JARRETT BRIAN · JARRETT BRIAN S
11 granted patents·5 pending applications·278 citations·filing 1995–2025
91Inventor score
Top patents by PatentIndex Score
16 records- 0193US9516792B2Ultrasound assisted immersion coolingINTEL CORP·Filed 2015·Granted Dec 6, 2016·23 cites·13 claims
- 0293US5622511AFloating connector housingINTEL CORP·Filed 1995·Granted Apr 22, 1997·92 cites·21 claims
- 0386US7152418B2Method and apparatus to manage airflow in a chassisINTEL CORP·Filed 2004·Granted Dec 26, 2006·36 cites·23 claims
- 0484US9606589B2Expansion card having synergistic cooling, structural and volume reduction solutionsGALLINA MARK J·Filed 2011·Granted Mar 28, 2017·13 cites·25 claims
- 0570US6167613B1Mechanism for engaging and disengaging electrical connector halvesINTEL CORP·Filed 1998·Granted Jan 2, 2001·25 cites·18 claims
- 0669US11817371B2Non-planar conforming heatsinkINTEL CORP·Filed 2018·Granted Nov 14, 2023·2 cites·23 claims
- 0767US5865518AFlexible computer chassis adapted to receive a plurality of different computer components of different sizes and configurationsINTEL CORP·Filed 1997·Granted Feb 2, 1999·55 cites·13 claims
- 0863US5735701ALocking power cable interface guardINTEL CORP·Filed 1995·Granted Apr 7, 1998·19 cites·18 claims
- 0952US6397461B1Method for engaging and disengaging electrical connector halvesINTEL CORP·Filed 2000·Granted Jun 4, 2002·4 cites·30 claims
- 1052US2025285939A1Compact form factor fluid flow regulatorINTEL CORP·Filed 2025·Application pending·0 cites
- 1150US11608919B2Universal quick disconnectINTEL CORP·Filed 2019·Granted Mar 21, 2023·0 cites·14 claims
- 1249US2023025921A1Cold plates and liquid cooling systems for electronic devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 1345US6044551ALocking power cable interface guardINTEL CORP·Filed 1998·Granted Apr 4, 2000·9 cites·13 claims
- 1444US2017071079A1Ultrasound assisted immersion coolingINTEL CORP·Filed 2016·Application pending·0 cites
- 1541US2015176915A1Interfacial thermal transfer structureKRISHNAN SHANKAR·Filed 2013·Application pending·0 cites
- 1633US2018058777A1Heat exchanger puckINTEL CORP·Filed 2016·Application pending·0 cites
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