Inventor · disambiguated record
Kazuyuki Mikubo
Also filed as: MIKUBO KAZUYUKI
11 granted patents·6 pending applications·299 citations·filing 1997–2009
91Inventor score
Top patents by PatentIndex Score
17 records- 0196US6611057B2Semiconductor device attaining both high speed processing and sufficient cooling capacityNEC CORP·Filed 2001·Granted Aug 26, 2003·136 cites·22 claims
- 0287US6670699B2Semiconductor device packaging structureNEC CORP·Filed 2002·Granted Dec 30, 2003·48 cites·23 claims
- 0386US7420807B2Cooling device for electronic apparatusNEC CORP·Filed 2003·Granted Sep 2, 2008·36 cites·25 claims
- 0478US8514364B2Dust and dirt resistant liquid crystal display deviceMIKUBO KAZUYUKI·Filed 2009·Granted Aug 20, 2013·6 cites·14 claims
- 0577US8264659B2Liquid crystal display deviceMIKUBO KAZUYUKI·Filed 2009·Granted Sep 11, 2012·8 cites·7 claims
- 0676US6438504B2Method of calculating thermal resistance in semiconductor package accommodating semiconductor chip within a case which can be applied to calculation for semiconductor package with radiation finsNEC CORP·Filed 2001·Granted Aug 20, 2002·21 cites·2 claims
- 0761US8698010B2Electronic apparatus, image display apparatus and method of cooling electronic apparatusSAKAMOTO HITOSHI·Filed 2009·Granted Apr 15, 2014·2 cites·9 claims
- 0856US6014314APackage structure of a multi-chip moduleNEC CORP·Filed 1998·Granted Jan 11, 2000·18 cites·10 claims
- 0955US7483261B2Cooling device for an electronic equipmentNEC CORP·Filed 2004·Granted Jan 27, 2009·6 cites·17 claims
- 1053US6238086B1Method of calculating thermal resistance in semiconductor package accommodating semiconductor chip within a case which can be applied to calculation for semiconductor package with radiation finsNEC CORP·Filed 1999·Granted May 29, 2001·16 cites·17 claims
- 1150US2008110600A1Cooling apparatus for electronic devicesNEC CORP·Filed 2007·Application pending·0 cites
- 1245US2010012299A1Heat exchanger unitNEC CORP·Filed 2008·Application pending·0 cites
- 1344US2010065260A1Vibration generating and cooling apparatusSAKAMOTO HITOSHI·Filed 2008·Application pending·0 cites
- 1444US2010025019A1Heat exchanger for cooling semiconductor chip and method of manufacturing the sameSAKAMOTO HITOSHI·Filed 2007·Application pending·0 cites
- 1543US2007006996A1Cooler for electronic equipmentMIKUBO KAZUYUKI·Filed 2004·Application pending·0 cites
- 1635US2006215715A1Heat sink, laser module, laser device, and laser-processing deviceKOUTA HIKARU·Filed 2004·Application pending·0 cites
- 1731US6194787B1Multistage coupling semiconductor carrier, semiconductor device using the semiconductor carrierNEC CORP·Filed 1997·Granted Feb 27, 2001·2 cites·8 claims
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