Inventor · disambiguated record
Ajoy Zutshi
Also filed as: ZUTSHI AJOY
8 granted patents·3 pending applications·160 citations·filing 1995–2022
87Inventor score
Files withAPPLIED MATERIALS INC4DUPONT AIR PROD NANOMATERIALS2ADVANCED CERAMICS CORP1AIR PROD & CHEM1BANERJEE GAUTAM1
Top patents by PatentIndex Score
11 records- 0192US7354332B2Technique for process-qualifying a semiconductor manufacturing tool using metrology dataAPPLIED MATERIALS INC·Filed 2004·Granted Apr 8, 2008·51 cites·39 claims
- 0288US7514363B2Chemical-mechanical planarization composition having benzenesulfonic acid and per-compound oxidizing agents, and associated method for useDUPONT AIR PROD NANOMATERIALS·Filed 2005·Granted Apr 7, 2009·13 cites·20 claims
- 0374US6261158B1Multi-step chemical mechanical polishingSPEEDFAM IPEC·Filed 1998·Granted Jul 17, 2001·57 cites·42 claims
- 0471US6620027B2Method and apparatus for hard pad polishingAPPLIED MATERIALS INC·Filed 2002·Granted Sep 16, 2003·14 cites·25 claims
- 0570US7678702B2CMP composition of boron surface-modified abrasive and nitro-substituted sulfonic acid and method of useAIR PROD & CHEM·Filed 2006·Granted Mar 16, 2010·3 cites·23 claims
- 0665US2023094483A1Pad conditioner with polymer backing plateENTEGRIS INC·Filed 2022·Application pending·0 cites
- 0763US7848839B2System, method, and medium for an endpoint detection scheme for copper low-dielectric damascene structures for improved dielectric and copper lossAPPLIED MATERIALS INC·Filed 2007·Granted Dec 7, 2010·1 cites·23 claims
- 0863US5604164ARefractory boat and method of manufactureADVANCED CERAMICS CORP·Filed 1995·Granted Feb 18, 1997·20 cites·11 claims
- 0960US9200180B2Chemical-mechanical planarization composition having benzenesulfonic acid and per-compound oxidizing agents, and associated method for useBANERJEE GAUTAM·Filed 2009·Granted Dec 1, 2015·1 cites·15 claims
- 1044US2009061630A1Method for Chemical Mechanical Planarization of A Metal-containing SubstrateDUPONT AIR PROD NANOMATERIALS·Filed 2008·Application pending·0 cites
- 1143US2006079007A1System, method, and medium for an endpoint detection scheme for copper low-dielectric damascene structures for improved dielectric and copper lossAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
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