Inventor · disambiguated record
Hun Teak Lee
Also filed as: LEE HUN TEAK
25 granted patents·2 pending applications·86 citations·filing 2004–2018
95Inventor score
Technology areasH10W
Top patents by PatentIndex Score
27 records- 0188US9997468B2Integrated circuit packaging system with shielding and method of manufacturing thereofSTATS CHIPPAC PTE LTD·Filed 2016·Granted Jun 12, 2018·5 cites·20 claims
- 0286US7453156B2Wire bond interconnectionCHIPPAC INC·Filed 2005·Granted Nov 18, 2008·11 cites·22 claims
- 0385US7909233B2Method of manufacturing a semiconductor package with fine pitch lead fingersSTATS CHIPPAC LTD·Filed 2010·Granted Mar 22, 2011·7 cites·10 claims
- 0481US9693455B1Integrated circuit packaging system with plated copper posts and method of manufacture thereofPARK SEONG WON·Filed 2014·Granted Jun 27, 2017·10 cites·20 claims
- 0579US7731078B2Semiconductor system with fine pitch lead fingersSTATS CHIPPAC LTD·Filed 2005·Granted Jun 8, 2010·7 cites·10 claims
- 0676US8129263B2Wire bond interconnection and method of manufacture thereofLEE HUN-TEAK·Filed 2011·Granted Mar 6, 2012·3 cites·16 claims
- 0775US8304874B2Stackable integrated circuit package systemLEE HUN TEAK·Filed 2006·Granted Nov 6, 2012·6 cites·20 claims
- 0874US7745322B2Wire bond interconnectionCHIPPAC INC·Filed 2008·Granted Jun 29, 2010·4 cites·8 claims
- 0972US9129826B2Epoxy bump for overhang dieLEE HUN TEAK·Filed 2006·Granted Sep 8, 2015·6 cites·17 claims
- 1072US7986047B2Wire bond interconnectionCHIPPAC INC·Filed 2010·Granted Jul 26, 2011·2 cites·9 claims
- 1169US9385100B1Integrated circuit packaging system with surface treatment and method of manufacture thereofLEE HUN TEAK·Filed 2015·Granted Jul 5, 2016·2 cites·14 claims
- 1269US7759783B2Integrated circuit package system employing thin profile techniquesSTATS CHIPPAC LTD·Filed 2006·Granted Jul 20, 2010·4 cites·20 claims
- 1368US8729687B2Stackable integrated circuit package systemSTATS CHIPPAC LTD·Filed 2012·Granted May 20, 2014·2 cites·20 claims
- 1467US7407080B2Wire bond capillary tipCHIPPAC INC·Filed 2004·Granted Aug 5, 2008·14 cites·18 claims
- 1563US8269356B2Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substratesPENDSE RAJENDRA D·Filed 2010·Granted Sep 18, 2012·1 cites·9 claims
- 1658US11145603B2Integrated circuit packaging system with shielding and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2018·Granted Oct 12, 2021·0 cites·16 claims
- 1758US11024585B2Integrated circuit packaging system with shielding and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2018·Granted Jun 1, 2021·0 cites·20 claims
- 1854US7863737B2Integrated circuit package system with wire bond patternSTATS CHIPPAC LTD·Filed 2006·Granted Jan 4, 2011·1 cites·20 claims
- 1951US7652382B2Micro chip-scale-package systemSTATS CHIPPAC LTD·Filed 2007·Granted Jan 26, 2010·0 cites·18 claims
- 2049US8256660B2Semiconductor package system with fine pitch lead fingers and method of manufacturing thereofLEE HUN TEAK·Filed 2011·Granted Sep 4, 2012·0 cites·21 claims
- 2148US7298052B2Micro chip-scale-package systemSTATS CHIPPAC LTD·Filed 2006·Granted Nov 20, 2007·0 cites·12 claims
- 2247US9093278B1Method of manufacture of integrated circuit packaging system with plasma processingCHOI JOONYOUNG·Filed 2013·Granted Jul 28, 2015·0 cites·20 claims
- 2347US8410594B2Inter-stacking module systemHWANG KWANG SOON·Filed 2006·Granted Apr 2, 2013·1 cites·8 claims
- 2445US8519517B2Semiconductor system with fine pitch lead fingers and method of manufacturing thereofLEE HUN TEAK·Filed 2011·Granted Aug 27, 2013·0 cites·10 claims
- 2543US2008272487A1System for implementing hard-metal wire bondsSHIM IL KWON·Filed 2008·Application pending·0 cites
- 2640US8716108B2Integrated circuit packaging system with ultra-thin chip and method of manufacture thereofLEE HUN TEAK·Filed 2012·Granted May 6, 2014·0 cites·14 claims
- 2740US2007001296A1Bump for overhang deviceSTATS CHIPPAC LTD·Filed 2006·Application pending·0 cites
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