Inventor · disambiguated record
Akihiro Aiba
Also filed as: AIBA AKIHIRO
14 granted patents·2 pending applications·79 citations·filing 2002–2013
91Inventor score
Top patents by PatentIndex Score
16 records- 0192US7704307B2Electroless palladium plating liquidNIPPON MINING CO·Filed 2006·Granted Apr 27, 2010·16 cites·4 claims
- 0291US7799188B2Electrolytic copper plating method, pure copper anode for electrolytic copper plating, and semiconductor wafer having low particle adhesion plated with said method and anodeNIPPON MINING CO·Filed 2009·Granted Sep 21, 2010·6 cites·6 claims
- 0388US7393395B2Surface-treating agent for metalNIPPON MINING CO·Filed 2005·Granted Jul 1, 2008·23 cites·11 claims
- 0485US7943033B2Electrolytic copper plating method, pure copper anode for electrolytic copper plating, and semiconductor wafer having low particle adhesion plated with said method and anodeJX NIPPON MINING & METALS CORP·Filed 2010·Granted May 17, 2011·2 cites·17 claims
- 0579US7138040B2Electrolytic copper plating method, phosphorous copper anode for electrolytic plating method, and semiconductor wafer having low particle adhesion plated with said method and anodeNIPPON MINING CO·Filed 2002·Granted Nov 21, 2006·12 cites·14 claims
- 0678US7396394B2Electroless gold plating solutionNIPPON MINING CO·Filed 2005·Granted Jul 8, 2008·3 cites·3 claims
- 0778US7374651B2Electrolytic copper plating method, phosphorus-containing anode for electrolytic copper plating, and semiconductor wafer plated using them and having few particles adhering to itNIPPON MINING CO·Filed 2002·Granted May 20, 2008·9 cites·8 claims
- 0873US9758901B2Vitreous silica crucible for pulling of silicon single crystal and method for manufacturing the sameSUMCO CORP·Filed 2013·Granted Sep 12, 2017·1 cites·7 claims
- 0973US8216438B2Copper anode or phosphorous-containing copper anode, method of electroplating copper on semiconductor wafer, and semiconductor wafer with low particle adhesionAIBA AKIHIRO·Filed 2008·Granted Jul 10, 2012·1 cites·9 claims
- 1071US7390354B2Electroless gold plating solutionNIKKO MATERIALS CO LTD·Filed 2005·Granted Jun 24, 2008·1 cites·3 claims
- 1169US7648621B2Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesionNIPPON MINING CO·Filed 2002·Granted Jan 19, 2010·4 cites·9 claims
- 1264US8252157B2Electrolytic copper plating method, phosphorous copper anode for electrolytic copper plating, and semiconductor wafer having low particle adhesion plated with said method and anodeAIBA AKIHIRO·Filed 2008·Granted Aug 28, 2012·0 cites·17 claims
- 1351US7419536B2Electroless gold plating liquidNIKKO MATERIALS CO LTD·Filed 2004·Granted Sep 2, 2008·1 cites·5 claims
- 1449US2014158546A1Electrolytic copper plating solution for filling for forming microwiring of copper for ulsiSEKIGUCHI JUNNOSUKE·Filed 2013·Application pending·0 cites
- 1548US8814997B2Electroless plating pretreatment agent, electroless plating method using same, and electroless plated objectIMORI TORU·Filed 2011·Granted Aug 26, 2014·0 cites·10 claims
- 1642US2012103820A1Electrolytic copper plating solution for filling for forming microwiring of copper for ulsiSEKIGUCHI JUNNOSUKE·Filed 2010·Application pending·0 cites
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