Inventor · disambiguated record
Bong-Hyun Kim
Also filed as: KIM BONG H · KIM BONG-HYUN
26 granted patents·6 pending applications·106 citations·filing 2001–2024
95Inventor score
Top patents by PatentIndex Score
32 records- 0184US11877443B2Semiconductor device including a single crystal contactSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 16, 2024·1 cites·13 claims
- 0283US9496328B2Methods of manufacturing capacitors for semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Nov 15, 2016·4 cites·20 claims
- 0383US9349821B2Electrode structure, method of fabricating the same, and semiconductor device including the electrode structureLEE DONG-KAK·Filed 2015·Granted May 24, 2016·3 cites·14 claims
- 0482US8012823B2Methods of fabricating stack type capacitors of semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Sep 6, 2011·8 cites·19 claims
- 0580US12219753B2Method for fabricating a semiconductor device having a single crystal storage contactSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
- 0677US7396719B2Method of forming high dielectric film using atomic layer deposition and method of manufacturing capacitor having the high dielectric filmSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jul 8, 2008·18 cites·4 claims
- 0777US6575175B2Braiding machineAMG IND INC·Filed 2001·Granted Jun 10, 2003·24 cites·16 claims
- 0876US6660587B2Method for forming a gate electrode in a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Dec 9, 2003·19 cites·10 claims
- 0972US9484219B2Methods of fabricating memory devices using wet etching and dry etchingPARK YOUNG-GEUN·Filed 2015·Granted Nov 1, 2016·2 cites·20 claims
- 1070US12382687B2Semiconductor device including insulating layers and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 5, 2025·0 cites·16 claims
- 1168US7521375B2Method of forming an oxinitride layerSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Apr 21, 2009·2 cites·23 claims
- 1266US8697570B2Semiconductor device including contact plug and method of manufacturing the sameJEON TAEK-SOO·Filed 2010·Granted Apr 15, 2014·3 cites·16 claims
- 1366US2025137147A1Method for manufacturing mos2-ni electrode using co-sputteringKOREA INSTITUTE OF ENERGY TECH·Filed 2024·Application pending·0 cites
- 1465US7592227B2Methods of manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 22, 2009·2 cites·22 claims
- 1565US6905927B2Method for forming a gate electrode in a semiconductor device including re-oxidation for restraining the thickness of the gate oxideSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jun 14, 2005·10 cites·19 claims
- 1663US9202813B2Electrode structure, method of fabricating the same, and semiconductor device including the electrode structureLEE DONG-KAK·Filed 2011·Granted Dec 1, 2015·1 cites·16 claims
- 1761US10685959B2Electrode structure, method of fabricating the same, and semiconductor device including the electrode structureSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 16, 2020·0 cites·20 claims
- 1861US7506981B2Image acquisition/output apparatus and ophthalmology picture system using the sameKIM BONG-HYUN·Filed 2005·Granted Mar 24, 2009·4 cites·19 claims
- 1960US8039344B2Methods of forming a capacitor structure and methods of manufacturing a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Oct 18, 2011·1 cites·15 claims
- 2059US9230922B2Precursor composition for deposition of silicon dioxide film and method for fabricating semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jan 5, 2016·0 cites·17 claims
- 2154US11605714B2Semiconductor device including insulating layers and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 14, 2023·0 cites·18 claims
- 2254US2016247802A1Electrode structure, method of fabricating the same, and semiconductor device including the electrode structureSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 2353US2008268653A1Method of forming high dielectric film using atomic layer deposition and method of manufacturing capacitor having the high dielectric filmSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2450US8928152B2Semiconductor device including contact plug and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jan 6, 2015·0 cites·7 claims
- 2546US6913979B2Method of manufacturing a metal oxide semiconductor transistorSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jul 5, 2005·2 cites·34 claims
- 2644US8877634B2Methods of forming a fine pattern on a substrate and methods of forming a semiconductor device having a fine patternSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Nov 4, 2014·0 cites·10 claims
- 2744US7297620B2Method of forming an oxide layer including increasing the temperature during oxidationSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Nov 20, 2007·0 cites·24 claims
- 2844US2011222207A1Methods of forming a dielectric layer structure, and methods of manufacturing a capacitor using the sameLEE TAE-JONG·Filed 2011·Application pending·0 cites
- 2942US7008876B2Method of forming gate electrode structure of a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Mar 7, 2006·2 cites·21 claims
- 3037US7008844B2Method of forming a gate of a non-volatile memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Mar 7, 2006·0 cites·11 claims
- 3137US2007085207A1Pad structure, method of forming a pad structure, semiconductor device having a pad structure and method of manufacturing a semiconductor deviceLEE WOO-SUNG·Filed 2006·Application pending·0 cites
- 3233US2005250343A1Method of manufacturing a semiconductor deviceLEE KONG-SOO·Filed 2005·Application pending·0 cites
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