Inventor · disambiguated record
Il-Goo Kim
Also filed as: KIM IL · KIM IL-GOO
20 granted patents·2 pending applications·287 citations·filing 1998–2022
95Inventor score
Files withSAMSUNG ELECTRONICS CO LTD13GLOBALFOUNDRIES US INC2SAMSUNG ELECTRO MECH2XIA TAI XIN SEMICONDUCTOR QING DAO LTD2GLOBALFOUNDRIES INC1
Top patents by PatentIndex Score
22 records- 0196US11423951B2Semiconductor structure and method for fabricating the sameXIA TAI XIN SEMICONDUCTOR QING DAO LTD·Filed 2020·Granted Aug 23, 2022·4 cites·8 claims
- 0294US7176126B2Method of fabricating dual damascene interconnectionSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 13, 2007·39 cites·18 claims
- 0392US11502087B2Semiconductor structure and method for fabricating the sameXIA TAI XIN SEMICONDUCTOR QING DAO LTD·Filed 2020·Granted Nov 15, 2022·3 cites·13 claims
- 0485US6924228B2Method of forming a via contact structure using a dual damascene techniqueSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Aug 2, 2005·42 cites·27 claims
- 0584US8835328B2Methods for fabricating integrated circuits with improved semiconductor fin structuresGLOBALFOUNDRIES INC·Filed 2013·Granted Sep 16, 2014·6 cites·20 claims
- 0683US6256849B1Method for fabricating microactuator for inkjet headSAMSUNG ELECTRO MECHANICS LTD·Filed 1998·Granted Jul 10, 2001·59 cites·8 claims
- 0775US6617232B2Method of forming wiring using a dual damascene processSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Sep 9, 2003·23 cites·23 claims
- 0875US6506680B1Method of forming connections with low dielectric insulating layersSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Jan 14, 2003·26 cites·46 claims
- 0971US7560332B2Integrated circuit capacitor structureSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jul 14, 2009·4 cites·14 claims
- 1071US6699749B1Method for manufacturing a metal-insulator-metal capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Mar 2, 2004·19 cites·20 claims
- 1168US11810853B2Top electrode interconnect structuresGLOBALFOUNDRIES US INC·Filed 2022·Granted Nov 7, 2023·0 cites·14 claims
- 1268US6254223B1Ink jet printer head actuator and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 1999·Granted Jul 3, 2001·22 cites·2 claims
- 1366US7553761B2Method of fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 30, 2009·3 cites·23 claims
- 1463US7157366B2Method of forming metal interconnection layer of semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jan 2, 2007·12 cites·38 claims
- 1563US6849536B2Inter-metal dielectric patterns and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Feb 1, 2005·12 cites·28 claims
- 1654US11315870B2Top electrode interconnect structuresGLOBALFOUNDRIES US INC·Filed 2018·Granted Apr 26, 2022·0 cites·15 claims
- 1748US7033944B2Dual damascene processSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Apr 25, 2006·3 cites·16 claims
- 1845US7229875B2Integrated circuit capacitor structureSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jun 12, 2007·1 cites·21 claims
- 1945US6351057B1Microactuator and method for fabricating the sameSAMSUNG ELECTRO MECH·Filed 1999·Granted Feb 26, 2002·9 cites·14 claims
- 2043US2008124917A1Method of manufacturing a semiconductor device having air gapsSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2142US2008073787A1Method forming metal interconnection filling recessed region using electro-plating techniqueOH JUN-HWAN·Filed 2007·Application pending·0 cites
- 2238US7026242B2Method for filling a hole with a metalSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Apr 11, 2006·0 cites·22 claims
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