Inventor · disambiguated record
Angel Pepe
Also filed as: PEPE ANGEL · PEPE ANGEL A · PEPE ANGEL ANTONIO
14 granted patents·3 pending applications·524 citations·filing 1989–2016
94Inventor score
Top patents by PatentIndex Score
17 records- 0192US7127807B2Process of manufacturing multilayer modulesIRVINE SENSORS CORP·Filed 2003·Granted Oct 31, 2006·69 cites·5 claims
- 0291US6784547B2Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layersIRVINE SENSORS CORP·Filed 2002·Granted Aug 31, 2004·46 cites·16 claims
- 0391US5406701AFabrication of dense parallel solder bump connectionsIRVINE SENSORS CORP·Filed 1993·Granted Apr 18, 1995·76 cites·25 claims
- 0488US6560109B2Stack of multilayer modules with heat-focusing metal layerIRVINE SENSORS CORP·Filed 2001·Granted May 6, 2003·44 cites·10 claims
- 0586US5279991AMethod for fabricating stacks of IC chips by segmenting a larger stackIRVINE SENSORS CORP·Filed 1992·Granted Jan 18, 1994·91 cites·24 claims
- 0683US6734370B2Multilayer modules with flexible substratesIRVINE SENSORS CORP·Filed 2001·Granted May 11, 2004·32 cites·13 claims
- 0780US7786562B2Stackable semiconductor chip layer comprising prefabricated trench interconnect viasOZGUZ VOLKAN·Filed 2005·Granted Aug 31, 2010·11 cites·34 claims
- 0880US6717061B2Stacking of multilayer modulesIRVINE SENSORS CORP·Filed 2001·Granted Apr 6, 2004·30 cites·3 claims
- 0974US5635010ADry adhesive joining of layers of electronic devicesFiled 1995·Granted Jun 3, 1997·59 cites·23 claims
- 1073US5091288AMethod of forming detector array contact bumps for improved lift off of excess metalROCKWELL INTERNATIONAL CORP·Filed 1989·Granted Feb 25, 1992·50 cites·17 claims
- 1170US6797537B2Method of making stackable layers containing encapsulated integrated circuit chips with one or more overlaying interconnect layersIRVINE SENSORS CORP·Filed 2001·Granted Sep 28, 2004·10 cites·21 claims
- 1260US7239012B2Three-dimensional module comprised of layers containing IC chips with overlying interconnect layersIRVINE SENSORS CORP·Filed 2004·Granted Jul 3, 2007·5 cites·2 claims
- 1359US9431275B2Wire bond through-via structure and methodBINDRUP RANDY·Filed 2011·Granted Aug 30, 2016·1 cites·12 claims
- 1448US9741680B1Wire bond through-via structure and methodPFG IP LLC·Filed 2016·Granted Aug 22, 2017·0 cites·1 claims
- 1541US2010291735A1Stackable semiconductor chip layer comprising prefabricated trench interconnect viasOZGUZ VOLKAN·Filed 2010·Application pending·0 cites
- 1637US2003049889A1Method of manufacturing multilayer modulesFiled 2001·Application pending·0 cites
- 1735US2004113222A1Stacked microelectronic module with vertical interconnect viasOZGUZ VOLKAN H·Filed 2003·Application pending·0 cites
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