Inventor · disambiguated record
Norihiro Nashida
Also filed as: NASHIDA NORIHIRO
15 granted patents·3 pending applications·17 citations·filing 2013–2023
88Inventor score
Top patents by PatentIndex Score
18 records- 0172US9991220B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2015·Granted Jun 5, 2018·2 cites·8 claims
- 0272US9773767B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2015·Granted Sep 26, 2017·2 cites·6 claims
- 0370US9852968B2Semiconductor device including a sealing regionFUJI ELECTRIC CO LTD·Filed 2015·Granted Dec 26, 2017·2 cites·12 claims
- 0470US9418916B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2015·Granted Aug 16, 2016·2 cites·15 claims
- 0568US9129840B2Semiconductor device and method for manufacturing sameFUJI ELECTRIC CO LTD·Filed 2014·Granted Sep 8, 2015·2 cites·18 claims
- 0667US10903130B2Semiconductor apparatus and manufacturing method of semiconductor apparatusFUJI ELECTRIC CO LTD·Filed 2017·Granted Jan 26, 2021·1 cites·12 claims
- 0767US9741587B2Semiconductor device and semiconductor device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2016·Granted Aug 22, 2017·1 cites·9 claims
- 0867US9627342B2Electronic component and method of manufacturing electronic componentFUJI ELECTRIC CO LTD·Filed 2013·Granted Apr 18, 2017·2 cites·23 claims
- 0963US9648732B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2014·Granted May 9, 2017·2 cites·13 claims
- 1063US9640454B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2015·Granted May 2, 2017·1 cites·10 claims
- 1158US2024153904A1Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2023·Application pending·0 cites
- 1256US12237237B2Semiconductor module and manufacturing method thereforFUJI ELECTRIC CO LTD·Filed 2022·Granted Feb 25, 2025·0 cites·14 claims
- 1353US2019300999A1Method of forming metallic filmTOKYO ELECTRON LTD·Filed 2019·Application pending·0 cites
- 1452US10079155B2Semiconductor device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2017·Granted Sep 18, 2018·0 cites·4 claims
- 1547US9355987B2Electronic component and manufacturing method for electronic componentFUJI ELECTRIC CO LTD·Filed 2014·Granted May 31, 2016·0 cites·14 claims
- 1643US9117795B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2013·Granted Aug 25, 2015·0 cites·6 claims
- 1741US10068870B2Semiconductor device including a connection unit and semiconductor device fabrication method of the sameFUJI ELECTRIC CO LTD·Filed 2016·Granted Sep 4, 2018·0 cites·12 claims
- 1836US2017365547A1Semiconductor device, manufacturing method, and conductive postFUJI ELECTRIC CO LTD·Filed 2017·Application pending·0 cites
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