US2019300999A1PendingUtilityA1

Method of forming metallic film

Assignee: TOKYO ELECTRON LTDPriority: Apr 2, 2018Filed: Mar 29, 2019Published: Oct 3, 2019
Est. expiryApr 2, 2038(~11.7 yrs left)· nominal 20-yr term from priority
C23C 4/134C23C 4/02C23C 4/06
53
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Claims

Abstract

A method of forming a metallic film is provided. The method includes: controlling gas conditions in a processing vessel in which a substrate is disposed on a stage; performing a pretreatment by spraying a plasma jet on the substrate in the processing vessel, the plasma jet being generated from gas containing an inert gas and hydrogen; and thermal spraying metallic material on the substrate while heating the stage at 100° C. or higher, the thermal spraying being performed after the pretreatment.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method of forming a metallic film, the method comprising:
 controlling gas conditions in a processing vessel in which a substrate is disposed on a stage;   performing a pretreatment by spraying a plasma jet on the substrate in the processing vessel, the plasma jet being generated from gas containing an inert gas and hydrogen; and   thermal spraying metallic material on the substrate while heating the stage at a temperature of 100° C. or higher, the thermal spraying being performed after the pretreatment.   
     
     
         2 . The method according to  claim 1 , further comprising raising a temperature of the stage to 100° C. or higher, before the thermal spraying. 
     
     
         3 . The method according to  claim 1 , wherein, in the controlling of the gas conditions in the processing vessel, oxygen concentration in the processing vessel is set to 100 ppm or less. 
     
     
         4 . The method according to  claim 1 , wherein the stage is an XY stage, and
 in the pretreatment, the plasma jet is sprayed on the substrate while moving the XY stage.   
     
     
         5 . The method according to  claim 1 , wherein the stage is an XY stage, and
 in the thermal spraying, the metallic material is sprayed on the substrate while moving the XY stage.   
     
     
         6 . The method according to  claim 1 , wherein the substrate is an insulating substrate having another metallic film on a surface of the insulating substrate, and
 in the thermal spraying, the metallic material is sprayed on a surface of said another metallic film.   
     
     
         7 . The method according to  claim 1 , wherein the substrate is an insulating substrate, and
 in the thermal spraying, the metallic material is sprayed on a surface of the insulating substrate.

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