Inventor · disambiguated record
Tsunehiro Nakajima
Also filed as: NAKAJIMA TSUNEHIRO
24 granted patents·2 pending applications·36 citations·filing 2006–2023
93Inventor score
Files withFUJI ELECTRIC CO LTD21FUJI ELECTRIC SYSTEMS CO LTD1KAZAMA KENICHI1NAKAZAWA HARUO1TOKYO ELECTRON LTD1
Top patents by PatentIndex Score
26 records- 0191US9685333B2Manufacturing method of silicon carbide semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2016·Granted Jun 20, 2017·7 cites·6 claims
- 0284US9147599B2Wafer support system and method for separating support substrate from solid-phase bonded wafer and method for manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2014·Granted Sep 29, 2015·6 cites·14 claims
- 0380US9972521B2Method for manufacturing semiconductor device to facilitate peeling of a supporting substrate bonded to a semiconductor waferFUJI ELECTRIC CO LTD·Filed 2015·Granted May 15, 2018·3 cites·7 claims
- 0475US10600921B2Silicon carbide semiconductor device and method of manufacturing silicon carbide semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2016·Granted Mar 24, 2020·2 cites·8 claims
- 0575US9564334B2Method of manufacturing a semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2016·Granted Feb 7, 2017·2 cites·9 claims
- 0675US9548205B2Method of manufacturing a semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2016·Granted Jan 17, 2017·2 cites·9 claims
- 0769US8962405B2Method of manufacturing semiconductor device by mounting and positioning a semiconductor die using detection marksFUJI ELECTRIC CO LTD·Filed 2013·Granted Feb 24, 2015·2 cites·13 claims
- 0868US8324044B2Method of producing a semiconductor device with an aluminum or aluminum alloy electrodeKAZAMA KENICHI·Filed 2010·Granted Dec 4, 2012·2 cites·6 claims
- 0967US9741587B2Semiconductor device and semiconductor device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2016·Granted Aug 22, 2017·1 cites·9 claims
- 1067US8604584B2Semiconductor device and method of manufacturing semiconductor deviceWAKIMOTO HIROKI·Filed 2011·Granted Dec 10, 2013·2 cites·6 claims
- 1165US7897452B2Method of producing a semiconductor device with an aluminum or aluminum alloy rear electrodeFUJI ELECTRIC SYSTEMS CO LTD·Filed 2006·Granted Mar 1, 2011·2 cites·15 claims
- 1264US9972499B2Method for forming metal-semiconductor alloy using hydrogen plasmaFUJI ELECTRIC CO LTD·Filed 2016·Granted May 15, 2018·1 cites·14 claims
- 1364US8999768B2Semiconductor device manufacturing methodNAKAZAWA HARUO·Filed 2011·Granted Apr 7, 2015·1 cites·9 claims
- 1463US9922858B2Semiconductor device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2015·Granted Mar 20, 2018·1 cites·15 claims
- 1563US9892919B2Semiconductor device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2015·Granted Feb 13, 2018·1 cites·15 claims
- 1660US12476218B2Semiconductor device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 1760US9728441B2Method for manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2015·Granted Aug 8, 2017·1 cites·19 claims
- 1855US2023207517A1Manufacturing method for semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2022·Application pending·0 cites
- 1954US9355858B2Method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2013·Granted May 31, 2016·0 cites·15 claims
- 2053US8722487B2Semiconductor device with an electrode including an aluminum-silicon filmFUJI ELECTRIC CO LTD·Filed 2012·Granted May 13, 2014·0 cites·6 claims
- 2153US2019300999A1Method of forming metallic filmTOKYO ELECTRON LTD·Filed 2019·Application pending·0 cites
- 2252US10079155B2Semiconductor device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2017·Granted Sep 18, 2018·0 cites·4 claims
- 2350US11658231B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2020·Granted May 23, 2023·0 cites·10 claims
- 2449US9905684B2Semiconductor device having schottky junction between substrate and drain electrodeFUJI ELECTRIC CO LTD·Filed 2015·Granted Feb 27, 2018·0 cites·14 claims
- 2546US10374050B2Silicon carbide semiconductor device and manufacturing method of silicon carbide semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2015·Granted Aug 6, 2019·0 cites·10 claims
- 2645US9070736B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2014·Granted Jun 30, 2015·0 cites·15 claims
Join the waitlist — get patent alerts
Get an alert when Tsunehiro Nakajima files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →