Inventor · disambiguated record
Panayotis Andricacos
Also filed as: ANDRICACOS PANAYOTIS · ANDRICACOS PANAYOTIS C · ANDRICACOS PANAYOTIS CONSTANTI · SAENGER KATHERINE L
52 granted patents·13 pending applications·3,245 citations·filing 1990–2009
99Inventor score
Top patents by PatentIndex Score
65 records- 0199US6224690B1Flip-Chip interconnections using lead-free soldersIBM·Filed 1996·Granted May 1, 2001·191 cites·12 claims
- 0298US5789320APlating of noble metal electrodes for DRAM and FRAMIBM·Filed 1996·Granted Aug 4, 1998·326 cites·29 claims
- 0397US5937320ABarrier layers for electroplated SnPb eutectic solder jointsIBM·Filed 1998·Granted Aug 10, 1999·297 cites·18 claims
- 0496US7190079B2Selective capping of copper wiringIBM·Filed 2005·Granted Mar 13, 2007·39 cites·9 claims
- 0596US7112851B2Field effect transistor with electroplated metal gateIBM·Filed 2005·Granted Sep 26, 2006·36 cites·20 claims
- 0696US7008871B2Selective capping of copper wiringIBM·Filed 2003·Granted Mar 7, 2006·105 cites·23 claims
- 0796US5516412AVertical paddle plating cellIBM·Filed 1995·Granted May 14, 1996·394 cites·21 claims
- 0895US6639488B2MEMS RF switch with low actuation voltageIBM·Filed 2001·Granted Oct 28, 2003·75 cites·24 claims
- 0995US6113769AApparatus to monitor and add plating solution of plating baths and controlling quality of deposited metalIBM·Filed 1997·Granted Sep 5, 2000·96 cites·41 claims
- 1094US6268291B1Method for forming electromigration-resistant structures by dopingIBM·Filed 1998·Granted Jul 31, 2001·183 cites·32 claims
- 1193US5522975AElectroplating workpiece fixtureIBM·Filed 1995·Granted Jun 4, 1996·144 cites·19 claims
- 1293US5312532AMulti-compartment eletroplating systemIBM·Filed 1993·Granted May 17, 1994·149 cites·21 claims
- 1392US7202764B2Noble metal contacts for micro-electromechanical switchesIBM·Filed 2003·Granted Apr 10, 2007·39 cites·13 claims
- 1492US6063506ACopper alloys for chip and package interconnectionsIBM·Filed 1998·Granted May 16, 2000·116 cites·59 claims
- 1592US5132859AThin film structures for magnetic recording headsIBM·Filed 1990·Granted Jul 21, 1992·58 cites·33 claims
- 1691US5352350AMethod for controlling chemical species concentrationIBM·Filed 1992·Granted Oct 4, 1994·75 cites·23 claims
- 1790US6967131B2Field effect transistor with electroplated metal gateIBM·Filed 2003·Granted Nov 22, 2005·43 cites·22 claims
- 1890US6589874B2Method for forming electromigration-resistant structures by dopingIBM·Filed 2001·Granted Jul 8, 2003·52 cites·13 claims
- 1989US6471845B1Method of controlling chemical bath composition in a manufacturing environmentIBM·Filed 1999·Granted Oct 29, 2002·63 cites·11 claims
- 2088US7638406B2Method of fabricating a high Q factor integrated circuit inductorIBM·Filed 2005·Granted Dec 29, 2009·13 cites·16 claims
- 2188US6974531B2Method for electroplating on resistive substratesIBM·Filed 2002·Granted Dec 13, 2005·20 cites·23 claims
- 2288US6344129B1Method for plating copper conductors and devices formedIBM·Filed 1999·Granted Feb 5, 2002·46 cites·17 claims
- 2387US6406608B1Apparatus to monitor and add plating solution to plating baths and controlling quality of deposited metalIBM·Filed 2000·Granted Jun 18, 2002·19 cites·41 claims
- 2486US6709562B1Method of making electroplated interconnection structures on integrated circuit chipsIBM·Filed 1999·Granted Mar 23, 2004·90 cites·49 claims
- 2586US6090710AMethod of making copper alloys for chip and package interconnectionsIBM·Filed 1997·Granted Jul 18, 2000·73 cites·16 claims
- 2686US5385661AAcid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential depositionIBM·Filed 1993·Granted Jan 31, 1995·43 cites·20 claims
- 2784US6429523B1Method for forming interconnects on semiconductor substrates and structures formedIBM·Filed 2001·Granted Aug 6, 2002·32 cites·35 claims
- 2884US5582927AHigh magnetic moment materials and process for fabrication of thin film headsIBM·Filed 1994·Granted Dec 10, 1996·33 cites·54 claims
- 2983US7060624B2Deep filled viasIBM·Filed 2003·Granted Jun 13, 2006·28 cites·16 claims
- 3082US5825609ACompound electrode stack capacitorIBM·Filed 1996·Granted Oct 20, 1998·58 cites·47 claims
- 3180US6251251B1Anode design for semiconductor depositionIBM·Filed 1998·Granted Jun 26, 2001·35 cites·27 claims
- 3279US6911229B2Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereofIBM·Filed 2002·Granted Jun 28, 2005·20 cites·14 claims
- 3377US6876282B2Micro-electro-mechanical RF switchIBM·Filed 2002·Granted Apr 5, 2005·18 cites·9 claims
- 3477US6416812B1Method for depositing copper onto a barrier layerIBM·Filed 2000·Granted Jul 9, 2002·20 cites·18 claims
- 3576US7212091B2Micro-electro-mechanical RF switchIBM·Filed 2005·Granted May 1, 2007·7 cites·13 claims
- 3676US6946716B2Electroplated interconnection structures on integrated circuit chipsIBM·Filed 2004·Granted Sep 20, 2005·16 cites·27 claims
- 3776US5998250ACompound electrode stack capacitorIBM·Filed 1998·Granted Dec 7, 1999·43 cites·6 claims
- 3875US7829427B2Method of fabricating a high Q factor integrated circuit inductorIBM·Filed 2009·Granted Nov 9, 2010·4 cites·16 claims
- 3975US6323127B1Capacitor formed with Pt electrodes having a 3D cup-like shape with roughened inner and outer surfacesIBM·Filed 2000·Granted Nov 27, 2001·21 cites·20 claims
- 4071US7581314B2Method of forming noble metal contactsIBM·Filed 2006·Granted Sep 1, 2009·5 cites·7 claims
- 4171US7068138B2High Q factor integrated circuit inductorIBM·Filed 2004·Granted Jun 27, 2006·12 cites·30 claims
- 4271US6188120B1Method and materials for through-mask electroplating and selective base removalIBM·Filed 1997·Granted Feb 13, 2001·32 cites·17 claims
- 4370US6395164B1Copper seed layer repair technique using electroless touch-upIBM·Filed 1999·Granted May 28, 2002·36 cites·3 claims
- 4467US6391773B2Method and materials for through-mask electroplating and selective base removalIBM·Filed 2000·Granted May 21, 2002·9 cites·30 claims
- 4559US6570255B2Method for forming interconnects on semiconductor substrates and structures formedIBM·Filed 2002·Granted May 27, 2003·7 cites·17 claims
- 4659US6331237B1Method of improving contact reliability for electroplatingIBM·Filed 1999·Granted Dec 18, 2001·12 cites·17 claims
- 4759US2005199502A1Method for electroplating on resistive substratesIBM·Filed 2005·Application pending·0 cites
- 4857US7678258B2Void-free damascene copper deposition process and means of monitoring thereofIBM·Filed 2003·Granted Mar 16, 2010·1 cites·11 claims
- 4957US7553400B2Plating apparatus and plating methodEBARA CORP·Filed 2004·Granted Jun 30, 2009·6 cites·16 claims
- 5055US2010051474A1Method and composition for electro-chemical-mechanical polishingANDRICACOS PANAYOTIS C·Filed 2009·Application pending·0 cites
Showing the top 50 of 65 patent records by PatentIndex Score.
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