Inventor · disambiguated record
John S. Kresge
Also filed as: KRESGE JOHN · KRESGE JOHN S · KRESGE JOHN STEVEN
46 granted patents·2 pending applications·1,630 citations·filing 1991–2010
99Inventor score
Files withIBM40ENDICOTT INTERCONNECT TECH INC5EGITTO FRANK D1ENDICOTT INTERNAT TECHNOLOGIES1JAPP ROBERT M1
Top patents by PatentIndex Score
48 records- 0197US6753612B2Economical high density chip carrierIBM·Filed 2001·Granted Jun 22, 2004·123 cites·20 claims
- 0295US7595454B2Method of making a circuitized substrate with enhanced circuitry and electrical assembly utilizing said substrateENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Sep 29, 2009·49 cites·22 claims
- 0395US6373717B1Electronic package with high density interconnect layerIBM·Filed 2000·Granted Apr 16, 2002·97 cites·16 claims
- 0494US5574630ALaminated electronic package including a power/ground assemblyIBM·Filed 1995·Granted Nov 12, 1996·189 cites·12 claims
- 0592US5798563APolytetrafluoroethylene thin film chip carrierIBM·Filed 1997·Granted Aug 25, 1998·112 cites·22 claims
- 0691US5384690AFlex laminate package for a parallel processorIBM·Filed 1993·Granted Jan 24, 1995·61 cites·11 claims
- 0790US6509546B1Laser excision of laminate chip carriersIBM·Filed 2000·Granted Jan 21, 2003·52 cites·29 claims
- 0890US6351393B1Electronic package for electronic components and method of making sameIBM·Filed 1999·Granted Feb 26, 2002·71 cites·93 claims
- 0990US5874776AThermal stress relieving substrateIBM·Filed 1997·Granted Feb 23, 1999·107 cites·13 claims
- 1089US5620782AMethod of fabricating a flex laminate packageIBM·Filed 1995·Granted Apr 15, 1997·59 cites·1 claims
- 1187US8198551B2Power core for use in circuitized substrate and method of making sameJAPP ROBERT M·Filed 2010·Granted Jun 12, 2012·9 cites·29 claims
- 1285US6829823B2Method of making a multi-layered interconnect structureIBM·Filed 2002·Granted Dec 14, 2004·31 cites·25 claims
- 1385US5829124AMethod for forming metallized patterns on the top surface of a printed circuit boardIBM·Filed 1995·Granted Nov 3, 1998·52 cites·55 claims
- 1485US5301118AMonte carlo simulation design methodologyIBM·Filed 1991·Granted Apr 5, 1994·110 cites·2 claims
- 1582US5956235AMethod and apparatus for flexibly connecting electronic devicesIBM·Filed 1998·Granted Sep 21, 1999·67 cites·19 claims
- 1681US5736679ADeformable interconnect structure for connecting an internal plane to a through-hole in a multilayer circuit boardIBM·Filed 1995·Granted Apr 7, 1998·49 cites·14 claims
- 1774US6259037B1Polytetrafluoroethylene thin film chip carrierIBM·Filed 1999·Granted Jul 10, 2001·35 cites·12 claims
- 1874US6066808AMultilayer circuit board having metallized patterns formed flush with a top surface thereofIBM·Filed 1998·Granted May 23, 2000·29 cites·5 claims
- 1973US8240027B2Method of making circuitized substrates having film resistors as part thereofEGITTO FRANK D·Filed 2008·Granted Aug 14, 2012·7 cites·16 claims
- 2072US6720502B1Integrated circuit structureIBM·Filed 2000·Granted Apr 13, 2004·17 cites·12 claims
- 2172US6073344ALaser segmentation of plated through-hole sidewalls to form multiple conductorsIBM·Filed 1999·Granted Jun 13, 2000·29 cites·22 claims
- 2270US6689543B2Laser ablatable material and its useIBM·Filed 2002·Granted Feb 10, 2004·12 cites·4 claims
- 2368US5509196AMethod of fabricating a flex laminate packageIBM·Filed 1994·Granted Apr 23, 1996·24 cites·3 claims
- 2466US6114098AMethod of filling an aperture in a substrateIBM·Filed 1998·Granted Sep 5, 2000·25 cites·13 claims
- 2566US6006428APolytetrafluoroethylene thin film chip carrierIBM·Filed 1998·Granted Dec 28, 1999·25 cites·7 claims
- 2665US6059579ASemiconductor structure interconnector and assemblyIBM·Filed 1997·Granted May 9, 2000·25 cites·15 claims
- 2764US7163847B2Method of making circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Jan 16, 2007·2 cites·16 claims
- 2864US6868604B2Method for forming an electrical structureIBM·Filed 2003·Granted Mar 22, 2005·8 cites·20 claims
- 2963US7024764B2Method of making an electronic packageIBM·Filed 2002·Granted Apr 11, 2006·8 cites·16 claims
- 3061US6998290B2Economical high density chip carrierIBM·Filed 2003·Granted Feb 14, 2006·7 cites·10 claims
- 3161US6562654B2Tented plated through-holes and method for fabrication thereofIBM·Filed 2001·Granted May 13, 2003·7 cites·13 claims
- 3260US6887779B2Integrated circuit structureIBM·Filed 2003·Granted May 3, 2005·8 cites·20 claims
- 3359US6348737B1Metallic interlocking structureIBM·Filed 2000·Granted Feb 19, 2002·8 cites·14 claims
- 3457US6693031B2Formation of a metallic interlocking structureIBM·Filed 2002·Granted Feb 17, 2004·7 cites·18 claims
- 3556US6483074B2Laser beam system for micro via formationIBM·Filed 2001·Granted Nov 19, 2002·5 cites·24 claims
- 3656US5781413AMethod and apparatus for directing the input/output connection of integrated circuit chip cube configurationsIBM·Filed 1996·Granted Jul 14, 1998·22 cites·8 claims
- 3755US6361923B1Laser ablatable material and its useIBM·Filed 1999·Granted Mar 26, 2002·14 cites·3 claims
- 3855US6341071B1Stress relieved ball grid array packageIBM·Filed 1999·Granted Jan 22, 2002·16 cites·21 claims
- 3955US6249045B1Tented plated through-holes and method for fabrication thereofIBM·Filed 1999·Granted Jun 19, 2001·13 cites·13 claims
- 4050US7084014B2Method of making circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2003·Granted Aug 1, 2006·3 cites·7 claims
- 4148US7091066B2Method of making circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Aug 15, 2006·0 cites·24 claims
- 4248US6559388B1Strain relief for substrates having a low coefficient of thermal expansionIBM·Filed 1999·Granted May 6, 2003·9 cites·12 claims
- 4345US6203652B1Method of forming a via in a substrateIBM·Filed 1999·Granted Mar 20, 2001·9 cites·18 claims
- 4445US2005224167A1Material separation to form segmented productENDICOTT INTERCONNECT TECH INC·Filed 2005·Application pending·0 cites
- 4543US6958106B2Material separation to form segmented productENDICOTT INTERNAT TECHNOLOGIES·Filed 2003·Granted Oct 25, 2005·3 cites·31 claims
- 4641US6228470B1Composite substrate for electronic componentsIBM·Filed 1998·Granted May 8, 2001·9 cites·20 claims
- 4737US2002166697A1Circuit board constructionIBM·Filed 2001·Application pending·0 cites
- 4836US5347710AParallel processor and method of fabricationIBM·Filed 1993·Granted Sep 20, 1994·6 cites·14 claims
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