Inventor · disambiguated record
Amit Sureshkumar Nangia
Also filed as: NANGIA AMIT · NANGIA AMIT SURESHKUMAR
13 granted patents·1 pending application·70 citations·filing 2000–2022
86Inventor score
Top patents by PatentIndex Score
14 records- 0191US6383873B1Process for forming a structureMOTOROLA INC·Filed 2000·Granted May 7, 2002·66 cites·12 claims
- 0288US11387155B2IC having a metal ring thereon for stress reductionTEXAS INSTRUMENTS INC·Filed 2020·Granted Jul 12, 2022·2 cites·24 claims
- 0376US10446414B2Semiconductor package with filler particles in a mold compoundTEXAS INSTRUMENTS INC·Filed 2017·Granted Oct 15, 2019·2 cites·19 claims
- 0472US11869820B2IC having a metal ring thereon for stress reductionTEXAS INSTRUMENTS INC·Filed 2022·Granted Jan 9, 2024·0 cites·21 claims
- 0569US12068261B2Strain-induced shift mitigation in semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2022·Granted Aug 20, 2024·0 cites·29 claims
- 0667US12119280B2Semiconductor device package with reduced stressTEXAS INSTRUMENTS INC·Filed 2022·Granted Oct 15, 2024·0 cites·18 claims
- 0763US11430747B2Strain-induced shift mitigation in semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2021·Granted Aug 30, 2022·0 cites·26 claims
- 0859US11139178B2Semiconductor package with filler particles in a mold compoundTEXAS INSTRUMENTS INC·Filed 2019·Granted Oct 5, 2021·0 cites·20 claims
- 0955US11121049B2Semiconductor package with a wire bond meshTEXAS INSTRUMENTS INC·Filed 2019·Granted Sep 14, 2021·0 cites·19 claims
- 1055US2021296196A1Semiconductor device package with reduced stressTEXAS INSTRUMENTS INC·Filed 2020·Application pending·0 cites
- 1154US12512434B2Semiconductor package for stress isolationTEXAS INSTRUMENTS INC·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 1254US12293948B2Flip chip semiconductor device package with mold compound sealTEXAS INSTRUMENTS INC·Filed 2021·Granted May 6, 2025·0 cites·23 claims
- 1354US10204842B2Semiconductor package with a wire bond meshTEXAS INSTRUMENTS INC·Filed 2018·Granted Feb 12, 2019·0 cites·20 claims
- 1442US9646950B2Corrosion-resistant copper bonds to aluminumTEXAS INSTRUMENTS INC·Filed 2016·Granted May 9, 2017·0 cites·15 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →