Inventor · disambiguated record
Michael J. Seddon
Also filed as: SEDDON MICHAEL · SEDDON MICHAEL J · SEDDON MICHAEL JOHN
172 granted patents·47 pending applications·964 citations·filing 1998–2025
99Inventor score
Files withSEMICONDUCTOR COMPONENTS IND LLC185SEMICONDUCTOR COMPONENTS IND25SEDDON MICHAEL J7BURGHOUT WILLIAM F1GRIVNA GORDON M1
Top patents by PatentIndex Score
219 records- 0198US11756830B2Jet ablation die singulation systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Sep 12, 2023·3 cites·14 claims
- 0298US11495529B2SOI substrate and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Nov 8, 2022·4 cites·19 claims
- 0398US11495493B2Backside metal patterning die singulation systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Nov 8, 2022·4 cites·19 claims
- 0498US8012857B2Semiconductor die singulation methodSEMICONDUCTOR COMPONENTS IND·Filed 2010·Granted Sep 6, 2011·58 cites·15 claims
- 0598US7989319B2Semiconductor die singulation methodSEMICONDUCTOR COMPONENTS IND·Filed 2010·Granted Aug 2, 2011·60 cites·20 claims
- 0697US11942366B2Backside metal patterning die singulation systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Mar 26, 2024·2 cites·18 claims
- 0797US11929285B2Backside metal patterning die singulation system and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Mar 12, 2024·2 cites·20 claims
- 0897US11581223B2Backside metal patterning die singulation system and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Feb 14, 2023·3 cites·20 claims
- 0997US10388526B1Semiconductor wafer thinning systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Aug 20, 2019·18 cites·20 claims
- 1097US8384231B2Method of forming a semiconductor dieSEMICONDUCTOR COMPONENTS IND·Filed 2010·Granted Feb 26, 2013·33 cites·16 claims
- 1196US11043422B2Jet ablation die singulation systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Jun 22, 2021·3 cites·20 claims
- 1296US10607889B1Jet ablation die singulation systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Mar 31, 2020·8 cites·20 claims
- 1396US10573803B1Current sensor packages with through hole in semiconductorSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Feb 25, 2020·8 cites·24 claims
- 1496US10090233B2Semiconductor device and method of forming micro interconnect structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Oct 2, 2018·8 cites·18 claims
- 1596US9564409B2Methods of forming semiconductor packages with an intermetallic layer comprising tin and at least one of silver, copper or nickelSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Feb 7, 2017·11 cites·17 claims
- 1696US9337098B1Semiconductor die back layer separation methodSEMICONDUCTOR COMPONENTS IND·Filed 2015·Granted May 10, 2016·22 cites·24 claims
- 1796US7319266B2Encapsulated electronic device structureSEMICONDUCTOR COMPONENTS IND·Filed 2005·Granted Jan 15, 2008·36 cites·6 claims
- 1896US6300679B1Flexible substrate for packaging a semiconductor componentSEMICONDUCTOR COMPONENTS IND·Filed 1998·Granted Oct 9, 2001·239 cites·30 claims
- 1995US12020972B2Curved semiconductor die systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Jun 25, 2024·3 cites·19 claims
- 2095US11373859B2Semiconductor substrate singulation systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Jun 28, 2022·4 cites·14 claims
- 2194US10014245B2Method for removing material from a substrate using in-situ thickness measurementSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Jul 3, 2018·5 cites·20 claims
- 2294US9793186B1Semiconductor wafer and method of backside probe testing through opening in film frameSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Oct 17, 2017·12 cites·18 claims
- 2392US10468304B1Semiconductor substrate production systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Nov 5, 2019·5 cites·20 claims
- 2492US9852972B2Semiconductor device and method of aligning semiconductor wafers for bondingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Dec 26, 2017·4 cites·18 claims
- 2592US9484210B2Semiconductor die singulation methodSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Nov 1, 2016·7 cites·44 claims
- 2692US6164523AElectronic component and method of manufactureSEMICONDUCTOR COMPONENTS IND·Filed 1998·Granted Dec 26, 2000·137 cites·9 claims
- 2791US12469709B2Semiconductor package electrical contact structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Nov 11, 2025·1 cites·20 claims
- 2891US9847310B2Flip chip bonding alloysSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Dec 19, 2017·8 cites·18 claims
- 2991US2025349550A1Die sidewall coatings and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 3091US2025349549A1Semiconductor devices having die support structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 3190US12211784B2SOI substrate and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Jan 28, 2025·0 cites·20 claims
- 3290US10964596B2Backside metal patterning die singulation system and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Mar 30, 2021·4 cites·7 claims
- 3390US10825725B2Backside metal patterning die singulation systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Nov 3, 2020·3 cites·20 claims
- 3490US8664089B1Semiconductor die singulation methodBURGHOUT WILLIAM F·Filed 2012·Granted Mar 4, 2014·19 cites·20 claims
- 3590USD489338SPackaged semiconductor deviceSEMICONDUCTOR COMPONENTS IND·Filed 2003·Granted May 4, 2004·43 cites·1 claims
- 3689US11437291B2Multichip module supports and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Sep 6, 2022·2 cites·15 claims
- 3789US10461000B2Semiconductor wafer and method of probe testingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Oct 29, 2019·6 cites·20 claims
- 3889US10199316B2Semiconductor device and method of aligning semiconductor wafers for bondingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Feb 5, 2019·2 cites·24 claims
- 3989US8292690B2Thinned semiconductor wafer and method of thinning a semiconductor waferSEDDON MICHAEL J·Filed 2008·Granted Oct 23, 2012·14 cites·20 claims
- 4089US2025062162A1Jet ablation die singulation systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 4188US12374555B2Die sidewall coatings and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
- 4288US12315765B2Backside metal patterning die singulation systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted May 27, 2025·0 cites·20 claims
- 4388US11710691B2Semiconductor device and method of forming micro interconnect structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Jul 25, 2023·1 cites·16 claims
- 4488US9165833B2Method of forming a semiconductor dieGRIVNA GORDON M·Filed 2010·Granted Oct 20, 2015·7 cites·7 claims
- 4587US12230559B2Semiconductor device and method of forming micro interconnect structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
- 4687US12230543B2Die cleaning systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
- 4787US10896815B2Semiconductor substrate singulation systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Jan 19, 2021·4 cites·18 claims
- 4887US10896819B2Backside metal photolithographic patterning die singulation systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jan 19, 2021·3 cites·20 claims
- 4987USD510728SSemiconductor device packageSEMICONDUCTOR COMPONENTS IND·Filed 2004·Granted Oct 18, 2005·34 cites·1 claims
- 5086US12341069B2Backside metal patterning die singulation system and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Jun 24, 2025·0 cites·20 claims
Showing the top 50 of 219 patent records by PatentIndex Score.
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