Inventor · disambiguated record
Mohd Hasrul Zulkifli
Also filed as: ZULKIFLI MOHD HASRUL · ZULKIFLI MOHD HASRUL BIN
10 granted patents·1 pending application·15 citations·filing 2017–2023
82Inventor score
Technology areasH10W
Top patents by PatentIndex Score
11 records- 0191US10121742B2Method of forming a packaged semiconductor device using ganged conductive connective assembly and structureAMKOR TECHNOLOGY INC·Filed 2017·Granted Nov 6, 2018·10 cites·20 claims
- 0280US11676881B2Semiconductor package, semiconductor assembly and method for fabricating a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jun 13, 2023·1 cites·20 claims
- 0380US10896869B2Method of manufacturing a semiconductor deviceAMKOR TECHNOLOGY INC·Filed 2018·Granted Jan 19, 2021·3 cites·20 claims
- 0475US12354934B2Method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 0573US11769748B2Semiconductor device having a metal clip with a solder volume balancing reservoirINFINEON TECHNOLOGIES AG·Filed 2022·Granted Sep 26, 2023·0 cites·20 claims
- 0668US10833008B2Method of forming a packaged semiconductor device using ganged conductive connective assembly and structureAMKOR TECHNOLOGY INC·Filed 2018·Granted Nov 10, 2020·1 cites·20 claims
- 0765US11764135B2Method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Sep 19, 2023·0 cites·10 claims
- 0864US11545459B2Metal clip with solder volume balancing reservoirINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 3, 2023·0 cites·16 claims
- 0960US2021013142A1Method of forming a packaged semiconductor device using ganged conductive connective assembly and structureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Application pending·0 cites
- 1049US11355424B2Multi-chip packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jun 7, 2022·0 cites·18 claims
- 1148US12057376B2Three level interconnect clipINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 6, 2024·0 cites·17 claims
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