Inventor · disambiguated record
Steve Meng-Yuan Hong
Also filed as: HONG STEVE M · HONG STEVE MENG-YUAN
9 granted patents·6 pending applications·44 citations·filing 2005–2024
85Inventor score
Top patents by PatentIndex Score
15 records- 0190US9900095B2Lighting apparatuses and LED modules for both illumination and optical communicationEPISTAR CORP·Filed 2017·Granted Feb 20, 2018·6 cites·19 claims
- 0289US8999736B2Optoelectronic systemHSIEH MIN-HSUN·Filed 2010·Granted Apr 7, 2015·8 cites·19 claims
- 0389US7683383B2Light emitting device having circuit protection unitEPISTAR CORP·Filed 2005·Granted Mar 23, 2010·20 cites·68 claims
- 0487US9748449B2Optoelectronic systemEPISTAR CORP·Filed 2015·Granted Aug 29, 2017·4 cites·15 claims
- 0586US2024421266A1Optoelectronic systemEPISTAR CORP·Filed 2024·Application pending·0 cites
- 0680US8450921B2Wavelength conversion structure, manufacturing methods thereof, and lighting emitting device including the wavelength conversion structureHSIEH MIN-HSUN·Filed 2012·Granted May 28, 2013·4 cites·20 claims
- 0772US2021226101A1Optoelectronic systemEPISTAR CORP·Filed 2021·Application pending·0 cites
- 0869US8853937B2Wavelength conversion structure, manufacturing method thereof, and light-emitting device comprising the wavelength conversion structureHSIEH MIN-HSUN·Filed 2012·Granted Oct 7, 2014·1 cites·17 claims
- 0960US10276753B2LED flip-chip package substrate and LED package structureKAISTAR LIGHTING XIAMEN CO LTD·Filed 2017·Granted Apr 30, 2019·1 cites·14 claims
- 1056US2017324009A1Optoelectronic systemEPISTAR CORP·Filed 2017·Application pending·0 cites
- 1147US2012269520A1Lighting apparatuses and led modules for both illumation and optical communicationHONG STEVE M·Filed 2011·Application pending·0 cites
- 1247US2015280824A1Lighting apparatuses and led modules for both illumination and optical communicationEPISTAR CORP·Filed 2015·Application pending·0 cites
- 1340US9965668B2Fingerprint image acquisition deviceKAISTAR LIGHTING XIAMEN CO LTD·Filed 2016·Granted May 8, 2018·0 cites·13 claims
- 1440US2008181270A1Packaging structure for the horizontal cavity surface emitting laser diode with monitor photodiodeLIN TA-TSUNG·Filed 2007·Application pending·0 cites
- 1535US9966518B2Package substrate and LED flip chip package structureKAISTAR LIGHTING XIAMEN CO LTD·Filed 2016·Granted May 8, 2018·0 cites·18 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →