Inventor · disambiguated record
Yun-Rae Cho
Also filed as: CHO YUN-RAE
26 granted patents·8 pending applications·226 citations·filing 2007–2024
95Inventor score
Top patents by PatentIndex Score
34 records- 0197US8143710B2Wafer-level chip-on-chip package, package on package, and methods of manufacturing the sameCHO YUN-RAE·Filed 2009·Granted Mar 27, 2012·131 cites·13 claims
- 0292US9099460B2Stack semiconductor package and manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 4, 2015·12 cites·13 claims
- 0391US10304781B2Semiconductor devices including guard ring and crack sensing circuitSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 28, 2019·7 cites·18 claims
- 0491US8232631B2Semiconductor packing having offset stack structureCHO YUN-RAE·Filed 2009·Granted Jul 31, 2012·24 cites·16 claims
- 0590US8664757B2High density chip stacked package, package-on-package and method of fabricating the sameCHO YUN-RAE·Filed 2011·Granted Mar 4, 2014·14 cites·17 claims
- 0687US10950586B2Semiconductor devices having upper and lower solder portions and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 16, 2021·4 cites·7 claims
- 0787US10490514B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 26, 2019·4 cites·15 claims
- 0882US10559543B2Semiconductor device having a protection trench, semiconductor wafer including the same, and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 11, 2020·4 cites·20 claims
- 0982US8890294B2Stack semiconductor package and manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 18, 2014·5 cites·6 claims
- 1079US10930602B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 23, 2021·2 cites·20 claims
- 1176US10418335B2Substrate, method of sawing substrate, and semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 17, 2019·2 cites·15 claims
- 1276US9716048B2Semiconductor device having a peripheral-region defect detection structureSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jul 25, 2017·2 cites·15 claims
- 1376US8946909B2Semiconductor package having gap-filler injection-friendly structureCHO YUN-RAE·Filed 2011·Granted Feb 3, 2015·4 cites·20 claims
- 1475US9984945B2Semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 29, 2018·2 cites·8 claims
- 1574US10103109B2Semiconductor device, semiconductor chip and method of manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 16, 2018·2 cites·19 claims
- 1673US8823171B2Semiconductor package, semiconductor device having the same, and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 2, 2014·3 cites·13 claims
- 1772US10916509B2Substrate, method of sawing substrate, and semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 9, 2021·1 cites·19 claims
- 1872US9553074B2Semiconductor package having cascaded chip stackSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 24, 2017·2 cites·15 claims
- 1971US10643958B2Semiconductor device, semiconductor chip and method of manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 5, 2020·1 cites·20 claims
- 2063US2025149480A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2162US11784137B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 10, 2023·0 cites·15 claims
- 2255US2025157960A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2355US2024088082A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2449US10923407B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 16, 2021·0 cites·12 claims
- 2548US9570411B2Pad structure of a semiconductor device, method of manufacturing the pad structure and semiconductor package including the pad structureSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Feb 14, 2017·0 cites·19 claims
- 2648US2010127374A1Multi-stack semiconductor package, semiconductor module and electronic signal processing system including thereofSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 2748US2017221866A1Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 2847US2009050885A1Semiconductor wafers and methods of fabricating semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2946US11158589B2Semiconductor device and semiconductor package comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 26, 2021·0 cites·20 claims
- 3045US7732934B2Semiconductor device having conductive adhesive layer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jun 8, 2010·0 cites·13 claims
- 3142US2014008772A1Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 3241US9543275B2Semiconductor package with a lead, package-on-package device including the same, and mobile device including the sameCHO YUN-RAE·Filed 2015·Granted Jan 10, 2017·0 cites·5 claims
- 3341US2020035649A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 3437US8491982B2Apparatus for manufacturing bonding structure, bonding structure and method of fabricating the sameAHN EUNCHUL·Filed 2011·Granted Jul 23, 2013·0 cites·8 claims
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