Inventor
CORBETT TIM J
US53 patents
⚠️ This page may combine multiple inventors who share the name “CORBETT TIM J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
49 patentsUS6087845AJul 11, 2000
Universal wafer carrier for wafer level die burn-in
MICRON TECHNOLOGY INC88 citations99
USRE36469EDec 28, 1999
Packaging for semiconductor logic devices
MICRON TECHNOLOGY INC181 citations99
US5138434AAug 11, 1992
Packaging for semiconductor logic devices
MICRON TECHNOLOGY INC327 citations99
US4992850AFeb 12, 1991
Directly bonded simm module
MICRON TECHNOLOGY INC233 citations99
US4992849AFeb 12, 1991
Directly bonded board multiple integrated circuit module
MICRON TECHNOLOGY INC175 citations99
US4899107AFeb 6, 1990
Discrete die burn-in for nonpackaged die
MICRON TECHNOLOGY INC308 citations99
US5302891AApr 12, 1994
Discrete die burn-in for non-packaged die
MICRON TECHNOLOGY INC224 citations98
US5985377ANov 16, 1999
Laser marking techniques
MICRON TECHNOLOGY INC89 citations97
US5905382AMay 18, 1999
Universal wafer carrier for wafer level die burn-in
MICRON TECHNOLOGY INC59 citations97
US5751015AMay 12, 1998
Semiconductor reliability test chip
MICRON TECHNOLOGY INC79 citations97
US6535012B1Mar 18, 2003
Universal wafer carrier for wafer level die burn-in
MICRON TECHNOLOGY INC20 citations96
US6320201B1Nov 20, 2001
Semiconductor reliability test chip
MICRON TECHNOLOGY INC76 citations96
US6217949B1Apr 17, 2001
Laser marking techniques
MICRON TECHNOLOGY INC23 citations96
US6157046ADec 5, 2000
Semiconductor reliability test chip
MICRON TECHNOLOGY INC37 citations96
US6113992ASep 5, 2000
Laser making techniques
MICRON TECHNOLOGY INC29 citations96
US6108026AAug 22, 2000
Laser marking techniques
MICRON TECHNOLOGY INC35 citations96
US5936260AAug 10, 1999
Semiconductor reliability test chip
MICRON TECHNOLOGY INC50 citations96
US5859539AJan 12, 1999
Universal wafer carrier for wafer level die burn-in
MICRON TECHNOLOGY INC41 citations96
US5838361ANov 17, 1998
Laser marking techniques
MICRON TECHNOLOGY INC34 citations96
US5781022AJul 14, 1998
Substrate having self limiting contacts for establishing an electrical connection with a semiconductor die
MICRON TECHNOLOGY INC53 citations96
US5726580AMar 10, 1998
Universal wafer carrier for wafer level die burn-in
MICRON TECHNOLOGY INC43 citations96
US5663654ASep 2, 1997
Universal wafer carrier for wafer level die burn-in
MICRON TECHNOLOGY INC44 citations96
US5585282ADec 17, 1996
Process for forming a raised portion on a projecting contact for electrical testing of a semiconductor
MICRON TECHNOLOGY INC64 citations96
US5548160AAug 20, 1996
Method and structure for attaching a semiconductor die to a lead frame
MICRON TECHNOLOGY INC80 citations96
US5539324AJul 23, 1996
Universal wafer carrier for wafer level die burn-in
MICRON TECHNOLOGY INC95 citations96
US6737882B2May 18, 2004
Method for universal wafer carrier for wafer level die burn-in
MICRON TECHNOLOGY INC17 citations93
US6342789B1Jan 29, 2002
Universal wafer carrier for wafer level die burn-in
MICRON TECHNOLOGY INC15 citations93
US6091254AJul 18, 2000
Universal wafer carrier for wafer level die burn-in
MICRON TECHNOLOGY INC16 citations93
USRE36325EOct 5, 1999
Directly bonded SIMM module
MICRON TECHNOLOGY INC30 citations93
US5945733AAug 31, 1999
Structure for attaching a semiconductor wafer section to a support
MICRON TECHNOLOGY INC33 citations93
US5767443AJun 16, 1998
Multi-die encapsulation device
MICRON TECHNOLOGY INC37 citations93
US5656551AAug 12, 1997
Method for attaching a semiconductor die to a support
MICRON TECHNOLOGY INC21 citations93
US6770906B2Aug 3, 2004
Semiconductor reliability test chip
MICRON TECHNOLOGY INC18 citations92
US6538264B2Mar 25, 2003
Semiconductor reliability test chip
MICRON TECHNOLOGY INC23 citations92
US6091250AJul 18, 2000
Discrete die burn-in for nonpackaged die
MICRON TECHNOLOGY INC33 citations92
US7452732B2Nov 18, 2008
Comparing identifying indicia formed using laser marking techniques to an identifying indicia model
MICRON TECHNOLOGY INC8 citations82
US6461690B2Oct 8, 2002
Laser marking techniques
MICRON TECHNOLOGY INC10 citations82
US6342912B1Jan 29, 2002
Laser marking techniques
MICRON TECHNOLOGY INC10 citations82
US7112986B2Sep 26, 2006
Method for testing using a universal wafer carrier for wafer level die burn-in
MICRON TECHNOLOGY INC2 citations74
US6683637B2Jan 27, 2004
Laser marking techniques
MICRON TECHNOLOGY INC3 citations74
US6429890B1Aug 6, 2002
Laser marking techniques
MICRON TECHNOLOGY INC6 citations74
US5910640AJun 8, 1999
Electrical contact assembly for use in a multi-die encapsulation device
MICRON TECHNOLOGY INC13 citations74
US7362113B2Apr 22, 2008
Universal wafer carrier for wafer level die burn-in
MICRON TECHNOLOGY INC1 citations63
US7288953B2Oct 30, 2007
Method for testing using a universal wafer carrier for wafer level die burn-in
MICRON TECHNOLOGY INC0 citations63
US7167014B2Jan 23, 2007
Method for testing using a universal wafer carrier for wafer level die burn-in
MICRON TECHNOLOGY INC0 citations63
US7167012B2Jan 23, 2007
Universal wafer carrier for wafer level die burn-in
MICRON TECHNOLOGY INC0 citations63
US7161373B2Jan 9, 2007
Method for testing using a universal wafer carrier for wafer level die burn-in
MICRON TECHNOLOGY INC0 citations63
US7141997B2Nov 28, 2006
Method for testing using a universal wafer carrier for wafer level die burn-in
MICRON TECHNOLOGY INC0 citations63
US7112985B2Sep 26, 2006
Method for testing using a universal wafer carrier for wafer level die burn-in
MICRON TECHNOLOGY INC0 citations63
(unassigned)
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