Inventor · disambiguated record
Byoung Wook Jang
Also filed as: JANG BYOUNG WOOK
18 granted patents·4 pending applications·150 citations·filing 2006–2023
93Inventor score
Top patents by PatentIndex Score
22 records- 0195US9349713B2Semiconductor package stack structure having interposer substrateKIM JONG-KOOK·Filed 2015·Granted May 24, 2016·62 cites·20 claims
- 0291US7871861B2Stacked integrated circuit package system with intra-stack encapsulationSTATS CHIPPAC LTD·Filed 2008·Granted Jan 18, 2011·22 cites·19 claims
- 0390US10622340B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 14, 2020·9 cites·18 claims
- 0488US7683467B2Integrated circuit package system employing structural supportSTATS CHIPPAC LTD·Filed 2006·Granted Mar 23, 2010·17 cites·20 claims
- 0586US10510672B2Semiconductor packages and methods of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 17, 2019·6 cites·20 claims
- 0684US8405197B2Integrated circuit packaging system with stacked configuration and method of manufacture thereofHA JONG-WOO·Filed 2009·Granted Mar 26, 2013·12 cites·20 claims
- 0781US9899487B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 20, 2018·4 cites·16 claims
- 0881US7968981B2Inline integrated circuit systemSTATS CHIPPAC LTD·Filed 2008·Granted Jun 28, 2011·8 cites·10 claims
- 0978US8501540B2Method for manufacture of inline integrated circuit systemYEE JAE HAK·Filed 2011·Granted Aug 6, 2013·4 cites·5 claims
- 1076US11133296B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 28, 2021·2 cites·18 claims
- 1161US2024357799A1Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1260US7994625B2Integrated circuit packaging system having an internal structure protrusion and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2008·Granted Aug 9, 2011·2 cites·20 claims
- 1358US8847413B2Integrated circuit package system with leads having multiple sides exposedYEE JAE HAK·Filed 2008·Granted Sep 30, 2014·1 cites·20 claims
- 1454US7863737B2Integrated circuit package system with wire bond patternSTATS CHIPPAC LTD·Filed 2006·Granted Jan 4, 2011·1 cites·20 claims
- 1551US8138591B2Integrated circuit package system with stacked dieYEE JAE HAK·Filed 2007·Granted Mar 20, 2012·0 cites·10 claims
- 1650US11469133B2Bonding apparatus and semiconductor package fabrication equipment including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 11, 2022·0 cites·20 claims
- 1749US8810019B2Integrated circuit package system with stacked dieYEE JAE HAK·Filed 2012·Granted Aug 19, 2014·0 cites·10 claims
- 1846US2011062599A1Integrated circuit packaging system with package stacking and method of manufacture thereofKIM JOON DONG·Filed 2009·Application pending·0 cites
- 1944US2015155216A1Semiconductor chip and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 2040US8481420B2Integrated circuit packaging system with lead frame stacking module and method of manufacture thereofHA JONG-WOO·Filed 2011·Granted Jul 9, 2013·0 cites·5 claims
- 2139US9370098B2Package substrates and integrated circuit packages including the sameJANG BYOUNG WOOK·Filed 2014·Granted Jun 14, 2016·0 cites·17 claims
- 2238US2009283889A1Integrated circuit package systemJANG BYOUNG WOOK·Filed 2008·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →