Inventor · disambiguated record
Hisayuki Tsuruta
Also filed as: TSURUTA HISAYUKI
5 granted patents·1 pending application·184 citations·filing 1994–2003
84Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0183US5357077AApparatus for marking semiconductor devicesNEC CORP·Filed 1994·Granted Oct 18, 1994·91 cites·4 claims
- 0278US6554598B1Mold assembly for encapsulating semiconductor deviceNEC ELECTRONICS CORP·Filed 2000·Granted Apr 29, 2003·28 cites·6 claims
- 0372US6676885B2Plural semiconductor devices bonded onto one face of a single circuit board for subsequent batch resin encapsulation of the plural semiconductor devices in a single cavity formed by molding diesNEC ELECTRONICS CORP·Filed 2001·Granted Jan 13, 2004·20 cites·17 claims
- 0470US6315540B1Molding die for concurrently molding semiconductor chips without voids and wire weepNEC CORP·Filed 2000·Granted Nov 13, 2001·16 cites·20 claims
- 0565US6200121B1Process for concurrently molding semiconductor chips without void and wire weep and molding die used thereinNEC CORP·Filed 1999·Granted Mar 13, 2001·29 cites·17 claims
- 0637US2003122279A1Mold assembly and method for encapsulating semiconductor deviceNEC CORP·Filed 2003·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →