Inventor · disambiguated record
Kevin Ceurter
Also filed as: CEURTER KEVIN · CEURTER KEVIN J
9 granted patents·4 pending applications·40 citations·filing 2006–2024
84Inventor score
Top patents by PatentIndex Score
13 records- 0191US7646607B2Quasi-radial heatsink with rectangular form factor and uniform fin lengthINTEL CORP·Filed 2008·Granted Jan 12, 2010·21 cites·24 claims
- 0284US10178763B2Warpage mitigation in printed circuit board assembliesINTEL CORP·Filed 2015·Granted Jan 8, 2019·5 cites·25 claims
- 0380US7471518B2Quasi-radial heatsink with rectangular form factor and uniform fin lengthINTEL CORP·Filed 2008·Granted Dec 30, 2008·7 cites·14 claims
- 0479US9825387B2Linear edge connector with a cable retention mechanism having a body with a groove with an indentation to receive a bolster plate protrusionINTEL CORP·Filed 2016·Granted Nov 21, 2017·3 cites·17 claims
- 0573US11291115B2Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array socketsINTEL CORP·Filed 2018·Granted Mar 29, 2022·2 cites·16 claims
- 0657US2025164812A1Electronic device including adjustable displayAPPLE INC·Filed 2024·Application pending·0 cites
- 0754US10541494B2Connector for processor packageINTEL CORP·Filed 2016·Granted Jan 21, 2020·1 cites·11 claims
- 0852US10070526B2Connector with structures for bi-lateral decoupling of a hardware interfaceINTEL CORP·Filed 2016·Granted Sep 4, 2018·1 cites·17 claims
- 0949US10455731B2Hydraulic bladder for CPU interconnection and coolingINTEL CORP·Filed 2017·Granted Oct 22, 2019·0 cites·18 claims
- 1043US10680367B2Cable retention assemblies including torsional elementsINTEL CORP·Filed 2016·Granted Jun 9, 2020·0 cites·6 claims
- 1143US2011013360A1Quasi-radial heatsink with rectangular form factor and uniform fin lengthGALLINA MARK J·Filed 2010·Application pending·0 cites
- 1243US2007188993A1Quasi-radial heatsink with rectangular form factor and uniform fin lengthGALLINA MARK J·Filed 2006·Application pending·0 cites
- 1332US2017178994A1Integrated circuit package support structuresINTEL CORP·Filed 2015·Application pending·0 cites
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