Inventor

PAPANU JAMES S

US62 patents

⚠️ This page may combine multiple inventors who share the name “PAPANU JAMES S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PAPANU JAMES S

APPLIED MATERIALS INC

Gas injection slit nozzle for a plasma process reactor

Method and apparatus for cleaning by-products from plasma chamber surfaces

Gas injection slit nozzle for a plasma process reactor

Gas injection slit nozzle for a plasma process reactor

Cleaning of native oxide with hydrogen-containing radicals

Substrate cleaning apparatus and method

Passivating, stripping and corrosion inhibition of semiconductor substrates

Wafer coating

Workpiece support platen for semiconductor process chamber

Method and apparatus for mask pellicle adhesive residue cleaning

Method of photoresist removal in the presence of a dielectric layer having a low k-value

Wet clean system design

Hybrid wafer dicing approach using a bessel beam shaper laser scribing process and plasma etch process

Cleaning submicron structures on a semiconductor wafer surface

Post-ion implant cleaning for silicon on insulator substrate preparation

Hybrid wafer dicing approach using a uniform rotating beam laser scribing process and plasma etch process

Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process

Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process

Method of outgassing a mask material deposited over a workpiece in a process tool

Baking tool for improved wafer coating process

Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process

Water soluble organic-inorganic hybrid mask formulations and their applications

Water soluble organic-inorganic hybrid mask formulations and their applications

Method and apparatus for removing a halogen-containing residue

Laser scribing trench opening control in wafer dicing using hybrid laser scribing and plasma etch approach

Hybrid wafer dicing approach using a spatially multi-focused laser beam laser scribing process and plasma etch process

Automatic kerf offset mapping and correction system for laser dicing

Electrostatic chuck with reduced current leakage for hybrid laser scribing and plasma etch wafer singulation process

Water vapor plasma to enhance surface hydrophilicity

Light-absorbing mask for hybrid laser scribing and plasma etch wafer singulation process

Etch mask for hybrid laser scribing and plasma etch wafer singulation process

Wafer coating

Water soluble mask formation by dry film lamination

LEI WEI-SHENG

Residue removal from singulated die sidewall

Laser-dominated laser scribing and plasma etch hybrid wafer dicing

UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach

Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch process

Vacuum lamination of polymeric dry films for wafer dicing using hybrid laser scribing and plasma etch approach

Singulation of wafers having wafer-level underfill

Maskless hybrid laser scribing and plasma etching wafer dicing process

Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate non-reactive post mask-opening clean

Water soluble mask formation by dry film lamination

Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing

Dicing wafers having solder bumps on wafer backside

Dicing processes for thin wafers with bumps on wafer backside

PARK JUNGRAE

Hybrid wafer dicing approach using a phase modulated laser beam profile laser scribing process and plasma etch process

Hybrid wafer dicing approach using laser scribing process based on an elliptical laser beam profile or a spatio-temporal controlled laser beam profile

PAPANU JAMES S

Method of die singulation using laser ablation and induction of internal defects with a laser

HOLDEN JAMES MATTHEW

Approaches for cleaning a wafer during hybrid laser scribing and plasma etching wafer dicing processes

HOLDEN JAMES M

Bi-layer wafer-level underfill mask for wafer dicing and approaches for performing wafer dicing