Inventor
YU MING-HUA
TW119 patents
⚠️ This page may combine multiple inventors who share the name “YU MING-HUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
32 patentsUS9768178B2Sep 19, 2017
Semiconductor device, static random access memory cell and manufacturing method of semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations93
US10269655B1Apr 23, 2019
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations90
US10490552B2Nov 26, 2019
FinFET device having flat-top epitaxial features and method of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD16 citations86
US10515858B1Dec 24, 2019
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10510753B2Dec 17, 2019
Integrated circuit and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10164096B2Dec 25, 2018
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10026843B2Jul 17, 2018
Fin structure of semiconductor device, manufacturing method thereof, and manufacturing method of active region of semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9831345B2Nov 28, 2017
FinFET with rounded source/drain profile
TAIWAN SEMICONDUCTOR MFG CO LTD13 citations84
US9825036B2Nov 21, 2017
Structure and method for semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US9601574B2Mar 21, 2017
V-shaped epitaxially formed semiconductor layer
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US11101347B2Aug 24, 2021
Confined source/drain epitaxy regions and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83
US11948971B2Apr 2, 2024
Confined source/drain epitaxy regions and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations74
US11916071B2Feb 27, 2024
Semiconductor device having epitaxy source/drain regions
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11489074B2Nov 1, 2022
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11444181B2Sep 13, 2022
Source/drain formation with reduced selective loss defects
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11315837B2Apr 26, 2022
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11211477B2Dec 28, 2021
FinFETs having epitaxial capping layer on fin and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11056578B2Jul 6, 2021
Method of forming shaped source/drain epitaxial layers of a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11037826B2Jun 15, 2021
Semiconductor device having merged epitaxial features with arc-like bottom surface and method of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10879128B2Dec 29, 2020
Semiconductor device and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10749029B2Aug 18, 2020
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10658468B2May 19, 2020
Epitaxial growth methods and structures thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10546784B2Jan 28, 2020
Semiconductor device having merged epitaxial features with arc-like bottom surface and method of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10516037B2Dec 24, 2019
Method of forming shaped source/drain epitaxial layers of a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10510868B2Dec 17, 2019
Fin Field-Effect Transistors and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10388792B2Aug 20, 2019
FinFET with rounded source/drain profile
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10355105B2Jul 16, 2019
Fin field-effect transistors and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10269937B2Apr 23, 2019
Semiconductor strips with undercuts and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9922975B2Mar 20, 2018
Integrated circuit having field-effect trasistors with dielectric fin sidewall structures and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9911829B2Mar 6, 2018
FinFET with bottom SiGe layer in source/drain
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US12426358B2Sep 23, 2025
Semiconductor device having epitaxy source/drain regions
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12369342B2Jul 22, 2025
Increasing source/drain dopant concentration to reduced resistance
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
TAIWAN SEMICONDUCTOR MFG
12 patentsUS8963258B2Feb 24, 2015
FinFET with bottom SiGe layer in source/drain
TAIWAN SEMICONDUCTOR MFG342 citations99
US7868317B2Jan 11, 2011
MOS devices with partial stressor channel
TAIWAN SEMICONDUCTOR MFG51 citations98
US7554110B2Jun 30, 2009
MOS devices with partial stressor channel
TAIWAN SEMICONDUCTOR MFG48 citations96
US7803690B2Sep 28, 2010
Epitaxy silicon on insulator (ESOI)
TAIWAN SEMICONDUCTOR MFG13 citations93
US7781799B2Aug 24, 2010
Source/drain strained layers
TAIWAN SEMICONDUCTOR MFG26 citations93
US7494884B2Feb 24, 2009
SiGe selective growth without a hard mask
TAIWAN SEMICONDUCTOR MFG36 citations92
US9293581B2Mar 22, 2016
FinFET with bottom SiGe layer in source/drain
TAIWAN SEMICONDUCTOR MFG8 citations84
US8846461B2Sep 30, 2014
Silicon layer for stopping dislocation propagation
TAIWAN SEMICONDUCTOR MFG8 citations84
US8377784B2Feb 19, 2013
Method for fabricating a semiconductor device
TAIWAN SEMICONDUCTOR MFG12 citations84
US8344447B2Jan 1, 2013
Silicon layer for stopping dislocation propagation
TAIWAN SEMICONDUCTOR MFG13 citations84
US8049277B2Nov 1, 2011
Epitaxy silicon on insulator (ESOI)
TAIWAN SEMICONDUCTOR MFG8 citations84
US6573189B1Jun 3, 2003
Manufacture method of metal bottom ARC
TAIWAN SEMICONDUCTOR MFG17 citations84
YU MING-HUA
2 patentsCHENG YU-HUNG
1 patentSU LILLY
1 patentLEE YEN-RU
1 patentPENG ERIC
1 patentShowing the top 50 of 119 patents by PatentIndex Score.