Inventor

MAHAJAN RAVI V

US22 patents

⚠️ This page may combine multiple inventors who share the name “MAHAJAN RAVI V”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MAHAJAN RAVI V

INTEL CORP

Localized high density substrate routing

Electronic assembly with high capacity thermal spreader and methods of manufacture

Substrate for reducing electromagnetic interference and enclosure

C4 package die backside coating

Method of forming electronic package having fluid-conducting channel

Microelectronic package and method of cooling an interconnect feature in same

Computer system having controlled cooling

Electronic packages, assemblies, and systems with fluid cooling

Integrated circuit package having a substrate vent hole

EMI containment for microprocessor core mounted on a card using surface mounted clips

Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme

Localized high density substrate routing

Cartridge and an enclosure for a semiconductor package

EMI containment for microprocessor core mounted on a card using surface mounted clips

Microelectronic die having a thermoelectric module

Localized high density substrate routing

Localized high density substrate routing

Localized high density substrate routing

Electronic assembly that includes stacked electronic devices

Flexible electronic assembly method

STARKSTON ROBERT

Localized high density substrate routing

RAMALINGAM SURESH

Process for assembling an integrated circuit package having a substrate vent hole