Process for assembling an integrated circuit package having a substrate vent hole

Abstract

The present invention involves a method of providing an integrated circuit package having a substrate with a vent opening. The integrated circuit package includes a substrate having an opening and an integrated circuit mounted to the substrate. An underfill material is dispensed between the substrate and the integrated circuit.

What is claimed is: 
     
       1. A process for assembling an integrated circuit, comprising:
 providing an a single opening through a substrate having a first surface having a portion upon which the integrated circuit is mounted and a second surface, said single opening being non-occluded at the second surface and having a diameter ranging from about 20 micrometers to about 62 micrometers; 
 attaching an integrated circuit to said substrate, said integrated circuit having four sides; 
 out-gassing through the said opening while dispensing an underfill material at at least one side of the along said four sides of said integrated circuit, the said underfill material completely filling a space between said integrated circuit and said substrate, said dispensing comprising a single pass dispensing pattern. 
 
     
     
       2. The process of  claim 1 , wherein the act of providing comprises:
 drilling said opening through said substrate, a first end of said opening having a diameter substantially equal to a diameter of a second end of said opening. 
 
     
     
       3. The process of  claim 1 , wherein the act of providing comprises lazing lasing said opening through said substrate, a first end of said opening having a diameter substantially equal to a diameter of a second end of said opening. 
     
     
       4. The process of  claim 1 , wherein the act of providing comprises providing said opening of at a predetermined location of said substrate. 
     
     
       5. The process of  claim 1 , wherein in the act of providing comprises providing said opening at a low-stress location of said substrate. 
     
     
       6. The process of  claim 1 , wherein the act of providing comprises providing said opening at a center of said substrate. 
     
     
       7. The process of  claim 1 , further comprising attaching a solder ball to said substrate. 
     
     
       8. A process for underfilling an integrated circuit, comprising:
 providing a substrate having a single vent opening, said single vent opening having a diameter ranging from about 20 mm micrometers to about 62 mm micrometers with a first end of said single vent opening at a top surface of said substrate being substantially equal in diameter to a second end of said single vent opening at a bottom surface of said substrate and said second end of said single vent opening being non-occluded; 
 mounting said integrated circuit to said top surface of the substrate, said integrated circuit having four sides; and 
 out-gassing through said single vent opening while dispensing an underfill material along said four sides of said integrated circuit, said underfill material being attached to said integrated circuit and said substrate, said underfill material completely filling a space between said integrated circuit and said substrate;, and said dispensing comprising a single pass dispensing pattern. 
 
     
     
       9. The process of  claim 8 , further comprising:
 curing said underfill material. 
 
     
     
       10. A process comprising:
 providing a single vent opening through a substrate, said single vent opening having a diameter ranging from about 20 mm micrometers to 62 mm micrometers with a top of the single vent opening being substantially uniform in diameter to a bottom of the single vent opening and said single vent opening being non-occluded at the bottom of the single vent opening; 
 attaching and an integrated circuit to said substrate above the top of the single vent opening, said integrated circuit having four sides; and 
 out-gassing through said single vent opening while dispensing an underfill material along said four sides of said integrated circuit, said underfill material completely filling a space between said integrated circuit and said substrate, and said dispensing comprising a single pass dispensing pattern. 
 
     
     
       11. The process of  claim 10 , wherein the act of providing comprises drilling said opening through said substrate, the bottom of the single vent opening is non-occluded. 
     
     
       12. The process of  claim 10 , wherein the act of providing comprises lazing lasing said opening through said substrate. 
     
     
       13. The process of  claim 10 , wherein the act of providing comprises providing said opening at a low-stress location of said substrate. 
     
     
       14. The process of  claim 10 , wherein the act of providing comprises providing said opening at a center of said substrate. 
     
     
       15. The process of  claim 10 , further comprising attaching a solder ball to said substrate. 
     
     
       16. The process of  claim 10 , wherein said substrate has a first surface and a second opposite surface, said opening extending from the first surface to the second opposite surface.