Inventor · disambiguated record
Yao-Jung Lee
Also filed as: LEE YAO J · LEE YAO-JUNG
16 granted patents·11 pending applications·315 citations·filing 2002–2011
94Inventor score
Files withCHIPMOS TECHNOLOGIES INC15CHIPMOS TECHNOLOGIES BERMUDA7HO TZONG-CHE2CHIPMOS TECHNOLOGIES BERMEDA L1CHIPMOS TECHNOLOGIES LTD1
Top patents by PatentIndex Score
27 records- 0192US6946860B2Modularized probe headCHIPMOS TECHNOLOGIES INC·Filed 2003·Granted Sep 20, 2005·57 cites·7 claims
- 0291US7088118B2Modularized probe card for high frequency probingCHIPMOS TECHNOLOGIES INC·Filed 2004·Granted Aug 8, 2006·55 cites·2 claims
- 0388US7372286B2Modular probe cardCHIPMOS TECHNOLOGIES BERMUDA·Filed 2006·Granted May 13, 2008·17 cites·6 claims
- 0488US6853205B1Probe card assemblyCHIPMOS TECHNOLOGIES BERMUDA·Filed 2003·Granted Feb 8, 2005·41 cites·9 claims
- 0586US7129730B2Probe card assemblyCHIPMOS TECHNOLOGIES INC·Filed 2004·Granted Oct 31, 2006·35 cites·6 claims
- 0685US7420267B2Image sensor assembly and method for fabricating the sameCHIPMOS TECHNOLOGIES BERMUDA·Filed 2005·Granted Sep 2, 2008·9 cites·7 claims
- 0783US8693711B2Capacitive transducer and fabrication methodHO TZONG-CHE·Filed 2009·Granted Apr 8, 2014·15 cites·15 claims
- 0879US6621710B1Modular probe card assemblyCHIPMOS TECHNOLOGIES BERMUDA·Filed 2002·Granted Sep 16, 2003·29 cites·1 claims
- 0969US6689638B2Substrate-on-chip packaging processCHIPMOS TECHNOLOGIES BERMUDA·Filed 2002·Granted Feb 10, 2004·19 cites·7 claims
- 1068US7372135B2Multi-chip image sensor moduleCHIPMOS TECHNOLOGIES BERMEDA L·Filed 2005·Granted May 13, 2008·6 cites·10 claims
- 1165US6781392B1Modularized probe card with compressible electrical connection deviceCHIPMOS TECHNOLOGIES LTD·Filed 2003·Granted Aug 24, 2004·14 cites·18 claims
- 1264US6812720B1Modularized probe card with coaxial transmittersCHIPMOS TECHNOLOGIES BERMUDA·Filed 2003·Granted Nov 2, 2004·11 cites·11 claims
- 1359US7936032B2Film type package for fingerprint sensorCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted May 3, 2011·2 cites·16 claims
- 1455US7812422B2Film type package for fingerprint sensorCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Oct 12, 2010·1 cites·13 claims
- 1552US7140101B2Method for fabricating anisotropic conductive substrateCHIPMOS TECHNOLOGIES INC·Filed 2003·Granted Nov 28, 2006·4 cites·10 claims
- 1648US2007152148A1Package structure of image sensor deviceCHIPMOS TECHNOLOGIES INC·Filed 2007·Application pending·0 cites
- 1746US2006087017A1Image sensor packageCHIPMOS TECHNOLOGIES INC·Filed 2005·Application pending·0 cites
- 1846US2006086890A1Package structure of image sensor deviceCHIPMOS TECHNOLOGIES INC·Filed 2005·Application pending·0 cites
- 1944US2006091510A1Probe card interposerCHIPMOS TECHNOLOGIES INC·Filed 2005·Application pending·0 cites
- 2043US7696443B2Electronic device with a warped spring connectorCHIPMOS TECHNOLOGIES BERMUDA·Filed 2005·Granted Apr 13, 2010·0 cites·17 claims
- 2141US2006231750A1Image sensor module packageCHIPMOS TECHNOLOGIES INC·Filed 2006·Application pending·0 cites
- 2241US2006086899A1Structure of image sensor packageCHIPMOS TECHNOLOGIES INC·Filed 2005·Application pending·0 cites
- 2340US2006043538A1Bump structure of an opto-electronic chipCHIPMOS TECHNOLOGIES INC·Filed 2005·Application pending·0 cites
- 2438US2007222465A1Probe head with vertical probes, method for manufacturing the probe head and probe card using the probe headCHIPMOS TECHNOLOGIES INC·Filed 2006·Application pending·0 cites
- 2537US2007085554A1Replaceable modular probe headCHIPMOS TECHNOLOGIES INC·Filed 2005·Application pending·0 cites
- 2636US2012146163A1Microphone package structure and method for fabricating the sameHO TZONG-CHE·Filed 2011·Application pending·0 cites
- 2734US2006022317A1Chip-under-tape package structure and manufacture thereofLIU AN-HONG·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →