P

Inventor

OKUMURA YOSHINORI

JP52 patents
⚠️ This page may combine multiple inventors who share the name “OKUMURA YOSHINORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MITSUBISHI ELECTRIC CORP

44 patents
US6461920B1Oct 8, 2002

Semiconductor device and method of manufacturing the same

MITSUBISHI ELECTRIC CORP124 citations98
US5763921AJun 9, 1998

Semiconductor device including retrograde well structure with suppressed substrate bias effects

MITSUBISHI ELECTRIC CORP136 citations98
US6492690B2Dec 10, 2002

Semiconductor device having control electrodes with different impurity concentrations

MITSUBISHI ELECTRIC CORP61 citations96
US6144079ANov 7, 2000

Semiconductor device and method of manufacturing the same

MITSUBISHI ELECTRIC CORP62 citations96
US5218221AJun 8, 1993

Semiconductor device and manufacturing method thereof

MITSUBISHI ELECTRIC CORP56 citations96
US5164806ANov 17, 1992

Element isolating structure of semiconductor device suitable for high density integration

MITSUBISHI ELECTRIC CORP68 citations96
US5101250AMar 31, 1992

Electrically programmable non-volatile memory device and manufacturing method thereof

MITSUBISHI ELECTRIC CORP99 citations94
US6300656B1Oct 9, 2001

Nonvolatile semiconductor memory device having a drain region of different impurity density and conductivity types

MITSUBISHI ELECTRIC CORP22 citations93
US5998828ADec 7, 1999

Semiconductor device having nitrogen introduced in its polysilicon gate

MITSUBISHI ELECTRIC CORP51 citations93
US5428239AJun 27, 1995

Semiconductor device having retrograde well and diffusion-type well

MITSUBISHI ELECTRIC CORP48 citations93
US5404042AApr 4, 1995

Semiconductor memory device having a plurality of well regions of different conductivities

MITSUBISHI ELECTRIC CORP26 citations93
US5240872AAug 31, 1993

Method of manufacturing semiconductor device having interconnection layer contacting source/drain regions

MITSUBISHI ELECTRIC CORP29 citations93
US5173752ADec 22, 1992

Semiconductor device having interconnection layer contacting source/drain regions

MITSUBISHI ELECTRIC CORP22 citations93
US4935380AJun 19, 1990

Method for manufacturing semiconductor device

MITSUBISHI ELECTRIC CORP34 citations93
US4912535AMar 27, 1990

Trench type semiconductor memory device having side wall contact

MITSUBISHI ELECTRIC CORP41 citations93
US4877750AOct 31, 1989

Method of fabricating a trench capacitor cell for a semiconductor memory device

MITSUBISHI ELECTRIC CORP25 citations93
US6388295B1May 14, 2002

Semiconductor device and method of manufacturing the same

MITSUBISHI ELECTRIC CORP21 citations92
US5594264AJan 14, 1997

LDD semiconductor device with peak impurity concentrations

MITSUBISHI ELECTRIC CORP32 citations92
US5032882AJul 16, 1991

Semiconductor device having trench type structure

MITSUBISHI ELECTRIC CORP40 citations92
US4985368AJan 15, 1991

Method for making semiconductor device with no stress generated at the trench corner portion

MITSUBISHI ELECTRIC CORP24 citations92
US4984055AJan 8, 1991

Semiconductor device having a plurality of conductive layers and manufacturing method therefor

MITSUBISHI ELECTRIC CORP33 citations92
US4894695AJan 16, 1990

Semiconductor device with no stress generated at the trench corner portion and the method for making the same

MITSUBISHI ELECTRIC CORP27 citations92
US5231041AJul 27, 1993

Manufacturing method of an electrically programmable non-volatile memory device having the floating gate extending over the control gate

MITSUBISHI ELECTRIC CORP22 citations91
US6577021B2Jun 10, 2003

Static-type semiconductor memory device

MITSUBISHI ELECTRIC CORP14 citations84
US6399985B2Jun 4, 2002

Semiconductor device

MITSUBISHI ELECTRIC CORP17 citations84
US5393688AFeb 28, 1995

Method of manufacturing a stacked capacitor DRAM

MITSUBISHI ELECTRIC CORP16 citations82
US5212542AMay 18, 1993

Semiconductor device having at least two field effect transistors and method of manufacturing the same

MITSUBISHI ELECTRIC CORP20 citations82
US6333535B2Dec 25, 2001

Semiconductor device

MITSUBISHI ELECTRIC CORP10 citations74
US6163046ADec 19, 2000

Semiconductor device and method of fabricating semiconductor device

MITSUBISHI ELECTRIC CORP8 citations74
US6020610AFeb 1, 2000

Semiconductor device and method of manufacturing the same

MITSUBISHI ELECTRIC CORP15 citations74
US5627093AMay 6, 1997

Method of manufacturing a wiring layer for use in a semiconductor device having a plurality of conductive layers

MITSUBISHI ELECTRIC CORP11 citations74
US5536957AJul 16, 1996

MOS field effect transistor having source/drain regions surrounded by impurity wells

MITSUBISHI ELECTRIC CORP17 citations74
US5502324AMar 26, 1996

Composite wiring layer

MITSUBISHI ELECTRIC CORP5 citations74
US4956692ASep 11, 1990

Semiconductor device having an isolation oxide film

MITSUBISHI ELECTRIC CORP11 citations74
US4953125AAug 28, 1990

Semiconductor memory device having improved connecting structure of bit line and memory cell

MITSUBISHI ELECTRIC CORP18 citations74
US4906591AMar 6, 1990

Method of manufacturing a semiconductor device having an electric contact portion

MITSUBISHI ELECTRIC CORP14 citations74
US4891327AJan 2, 1990

Method for manufacturing field effect transistor

MITSUBISHI ELECTRIC CORP11 citations74
US4741802AMay 3, 1988

Method for manufacturing semiconductor device

MITSUBISHI ELECTRIC CORP11 citations74
US5153689AOct 6, 1992

Semiconductor memory device having bit lines formed of an interconnecting layer of lower reflectance material than the material of the word lines

MITSUBISHI ELECTRIC CORP14 citations73
US5300444AApr 5, 1994

Method of manufacturing a semiconductor device having a stacked structure formed of polycrystalline silicon film and silicon oxide film

MITSUBISHI ELECTRIC CORP9 citations71
US6162669ADec 19, 2000

Method of manufacturing a semiconductor device having an LDD structure with a recess in the source/drain region formed during removal of a damaged layer

MITSUBISHI ELECTRIC CORP5 citations63
US5932912AAug 3, 1999

Semiconductor device having LDD structure with a recess in the source/drain region which is formed during the removal of a damaged layer

MITSUBISHI ELECTRIC CORP5 citations63
US5281838AJan 25, 1994

Semiconductor device having contact between wiring layer and impurity region

MITSUBISHI ELECTRIC CORP6 citations63
US5280444AJan 18, 1994

Dram comprising stacked-type capacitor having vertically protruding part and method of manufacturing the same

MITSUBISHI ELECTRIC CORP4 citations63

RENESAS TECH CORP

6 patents

Showing the top 50 of 52 patents by PatentIndex Score.