Inventor
OKUMURA YOSHINORI
JP52 patents
⚠️ This page may combine multiple inventors who share the name “OKUMURA YOSHINORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
44 patentsUS6461920B1Oct 8, 2002
Semiconductor device and method of manufacturing the same
MITSUBISHI ELECTRIC CORP124 citations98
US5763921AJun 9, 1998
Semiconductor device including retrograde well structure with suppressed substrate bias effects
MITSUBISHI ELECTRIC CORP136 citations98
US6492690B2Dec 10, 2002
Semiconductor device having control electrodes with different impurity concentrations
MITSUBISHI ELECTRIC CORP61 citations96
US6144079ANov 7, 2000
Semiconductor device and method of manufacturing the same
MITSUBISHI ELECTRIC CORP62 citations96
US5218221AJun 8, 1993
Semiconductor device and manufacturing method thereof
MITSUBISHI ELECTRIC CORP56 citations96
US5164806ANov 17, 1992
Element isolating structure of semiconductor device suitable for high density integration
MITSUBISHI ELECTRIC CORP68 citations96
US5101250AMar 31, 1992
Electrically programmable non-volatile memory device and manufacturing method thereof
MITSUBISHI ELECTRIC CORP99 citations94
US6300656B1Oct 9, 2001
Nonvolatile semiconductor memory device having a drain region of different impurity density and conductivity types
MITSUBISHI ELECTRIC CORP22 citations93
US5998828ADec 7, 1999
Semiconductor device having nitrogen introduced in its polysilicon gate
MITSUBISHI ELECTRIC CORP51 citations93
US5428239AJun 27, 1995
Semiconductor device having retrograde well and diffusion-type well
MITSUBISHI ELECTRIC CORP48 citations93
US5404042AApr 4, 1995
Semiconductor memory device having a plurality of well regions of different conductivities
MITSUBISHI ELECTRIC CORP26 citations93
US5240872AAug 31, 1993
Method of manufacturing semiconductor device having interconnection layer contacting source/drain regions
MITSUBISHI ELECTRIC CORP29 citations93
US5173752ADec 22, 1992
Semiconductor device having interconnection layer contacting source/drain regions
MITSUBISHI ELECTRIC CORP22 citations93
US4935380AJun 19, 1990
Method for manufacturing semiconductor device
MITSUBISHI ELECTRIC CORP34 citations93
US4912535AMar 27, 1990
Trench type semiconductor memory device having side wall contact
MITSUBISHI ELECTRIC CORP41 citations93
US4877750AOct 31, 1989
Method of fabricating a trench capacitor cell for a semiconductor memory device
MITSUBISHI ELECTRIC CORP25 citations93
US6388295B1May 14, 2002
Semiconductor device and method of manufacturing the same
MITSUBISHI ELECTRIC CORP21 citations92
US5594264AJan 14, 1997
LDD semiconductor device with peak impurity concentrations
MITSUBISHI ELECTRIC CORP32 citations92
US5032882AJul 16, 1991
Semiconductor device having trench type structure
MITSUBISHI ELECTRIC CORP40 citations92
US4985368AJan 15, 1991
Method for making semiconductor device with no stress generated at the trench corner portion
MITSUBISHI ELECTRIC CORP24 citations92
US4984055AJan 8, 1991
Semiconductor device having a plurality of conductive layers and manufacturing method therefor
MITSUBISHI ELECTRIC CORP33 citations92
US4894695AJan 16, 1990
Semiconductor device with no stress generated at the trench corner portion and the method for making the same
MITSUBISHI ELECTRIC CORP27 citations92
US5231041AJul 27, 1993
Manufacturing method of an electrically programmable non-volatile memory device having the floating gate extending over the control gate
MITSUBISHI ELECTRIC CORP22 citations91
US6577021B2Jun 10, 2003
Static-type semiconductor memory device
MITSUBISHI ELECTRIC CORP14 citations84
US6399985B2Jun 4, 2002
Semiconductor device
MITSUBISHI ELECTRIC CORP17 citations84
US5393688AFeb 28, 1995
Method of manufacturing a stacked capacitor DRAM
MITSUBISHI ELECTRIC CORP16 citations82
US5212542AMay 18, 1993
Semiconductor device having at least two field effect transistors and method of manufacturing the same
MITSUBISHI ELECTRIC CORP20 citations82
US6333535B2Dec 25, 2001
Semiconductor device
MITSUBISHI ELECTRIC CORP10 citations74
US6163046ADec 19, 2000
Semiconductor device and method of fabricating semiconductor device
MITSUBISHI ELECTRIC CORP8 citations74
US6020610AFeb 1, 2000
Semiconductor device and method of manufacturing the same
MITSUBISHI ELECTRIC CORP15 citations74
US5627093AMay 6, 1997
Method of manufacturing a wiring layer for use in a semiconductor device having a plurality of conductive layers
MITSUBISHI ELECTRIC CORP11 citations74
US5536957AJul 16, 1996
MOS field effect transistor having source/drain regions surrounded by impurity wells
MITSUBISHI ELECTRIC CORP17 citations74
US5502324AMar 26, 1996
Composite wiring layer
MITSUBISHI ELECTRIC CORP5 citations74
US4956692ASep 11, 1990
Semiconductor device having an isolation oxide film
MITSUBISHI ELECTRIC CORP11 citations74
US4953125AAug 28, 1990
Semiconductor memory device having improved connecting structure of bit line and memory cell
MITSUBISHI ELECTRIC CORP18 citations74
US4906591AMar 6, 1990
Method of manufacturing a semiconductor device having an electric contact portion
MITSUBISHI ELECTRIC CORP14 citations74
US4891327AJan 2, 1990
Method for manufacturing field effect transistor
MITSUBISHI ELECTRIC CORP11 citations74
US4741802AMay 3, 1988
Method for manufacturing semiconductor device
MITSUBISHI ELECTRIC CORP11 citations74
US5153689AOct 6, 1992
Semiconductor memory device having bit lines formed of an interconnecting layer of lower reflectance material than the material of the word lines
MITSUBISHI ELECTRIC CORP14 citations73
US5300444AApr 5, 1994
Method of manufacturing a semiconductor device having a stacked structure formed of polycrystalline silicon film and silicon oxide film
MITSUBISHI ELECTRIC CORP9 citations71
US6162669ADec 19, 2000
Method of manufacturing a semiconductor device having an LDD structure with a recess in the source/drain region formed during removal of a damaged layer
MITSUBISHI ELECTRIC CORP5 citations63
US5932912AAug 3, 1999
Semiconductor device having LDD structure with a recess in the source/drain region which is formed during the removal of a damaged layer
MITSUBISHI ELECTRIC CORP5 citations63
US5281838AJan 25, 1994
Semiconductor device having contact between wiring layer and impurity region
MITSUBISHI ELECTRIC CORP6 citations63
US5280444AJan 18, 1994
Dram comprising stacked-type capacitor having vertically protruding part and method of manufacturing the same
MITSUBISHI ELECTRIC CORP4 citations63
RENESAS TECH CORP
6 patentsUS6777758B2Aug 17, 2004
Semiconductor device
RENESAS TECH CORP31 citations93
US6815295B1Nov 9, 2004
Method of manufacturing field effect transistors
RENESAS TECH CORP7 citations74
US6770522B2Aug 3, 2004
Semiconductor device and manufacturing method thereof
RENESAS TECH CORP10 citations74
US6734486B2May 11, 2004
Recessed plug semiconductor device and manufacturing method thereof
RENESAS TECH CORP8 citations74
US7180773B2Feb 20, 2007
Magnetic memory device
RENESAS TECH CORP3 citations63
US6670277B2Dec 30, 2003
Method of manufacturing semiconductor device
RENESAS TECH CORP3 citations63
Showing the top 50 of 52 patents by PatentIndex Score.