Inventor · disambiguated record
Seiji Izutani
Also filed as: IZUTANI SEIJI
4 granted patents·20 pending applications·8 citations·filing 2001–2014
65Inventor score
Top patents by PatentIndex Score
24 records- 0178US8592844B2Light-emitting diode deviceIZUTANI SEIJI·Filed 2011·Granted Nov 26, 2013·5 cites·7 claims
- 0260US6709702B2Cover tape for electronic part conveyance and electronic part conveying memberNITTO DENKO CORP·Filed 2001·Granted Mar 23, 2004·2 cites·13 claims
- 0355US8749978B2Power moduleIZUTANI SEIJI·Filed 2011·Granted Jun 10, 2014·1 cites·4 claims
- 0453US2015090922A1Thermally conductive sheetNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 0553US2014367883A1Producing method of thermally conductive sheetNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 0649US2008073034A1Method for thermally releasing adherend and apparatus for thermally releasing adherendNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 0745US2011127461A1Thermally conductive composition and method for producing themNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 0843US2013200298A1Thermal conductive sheetNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 0942US8547465B2Imaging device moduleIZUTANI SEIJI·Filed 2011·Granted Oct 1, 2013·0 cites·3 claims
- 1041US2011259567A1Thermal conductive sheetNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 1141US2014213751A1Epoxy composition and epoxy resin molded articleNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 1240US2011129677A1Organic-inorganic composite and manufacturing method thereforNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 1339US2011259564A1Thermal conductive sheetNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 1437US2002195199A1Method for thermally releasing adherend and apparatus for thermally releasing adherendNITTO DENKO CORP·Filed 2002·Application pending·0 cites
- 1536US2013065016A1Thermal conductive sheet and producing method thereofIZUTANI SEIJI·Filed 2012·Application pending·0 cites
- 1636US2011262728A1Thermal conductive sheet, light-emitting diode mounting substrate, and thermal conductive adhesive sheetNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 1736US2013062046A1Thermal conductive sheet and producing method thereofIZUTANI SEIJI·Filed 2012·Application pending·0 cites
- 1835US2011259569A1Thermal conductive sheetNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 1935US2011267557A1Back light and liquid crystal display deviceNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 2035US2011259568A1Thermal conductive sheetNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 2135US2011259566A1Thermal conductive sheetNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 2234US2014008566A1Producing method of thermally conductive sheet and thermally conductive sheetKITAGAWA HISAE·Filed 2012·Application pending·0 cites
- 2332US2011259565A1Heat dissipation structureNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 2429US2013065987A1Thermal conductive sheet and producing method thereofFUKUZAKI SAORI·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →