Inventor · disambiguated record
Recai Sezi
Also filed as: SEZI RECAI
83 granted patents·14 pending applications·1,015 citations·filing 1988–2016
99Inventor score
Top patents by PatentIndex Score
97 records- 0197US8183696B2Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact padsMEYER THORSTEN·Filed 2010·Granted May 22, 2012·47 cites·20 claims
- 0297US5234793AMethod for dimensionally accurate structure transfer in bilayer technique wherein a treating step with a bulging agent is employed after developmentSIEMENS AG·Filed 1990·Granted Aug 10, 1993·144 cites·20 claims
- 0395US8258633B2Semiconductor package and multichip arrangement having a polymer layer and an encapsulantSEZI RECAI·Filed 2010·Granted Sep 4, 2012·43 cites·19 claims
- 0493US9293423B2Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chipsINTEL MOBILE COMM GMBH·Filed 2014·Granted Mar 22, 2016·11 cites·15 claims
- 0593US8741690B2Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact padsMEYER THORSTEN·Filed 2012·Granted Jun 3, 2014·16 cites·25 claims
- 0693US7687895B2Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chipsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 30, 2010·30 cites·41 claims
- 0793US5173393AEtch-resistant deep ultraviolet resist process having an aromatic treating step after developmentSIEMENS AG·Filed 1990·Granted Dec 22, 1992·94 cites·9 claims
- 0890US5250375APhotostructuring processSIEMENS AG·Filed 1991·Granted Oct 5, 1993·66 cites·14 claims
- 0986US5234794APhotostructuring methodSIEMENS AG·Filed 1992·Granted Aug 10, 1993·50 cites·17 claims
- 1085US8779563B2Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chipsINTEL MOBILE COMM GMBH·Filed 2012·Granted Jul 15, 2014·6 cites·11 claims
- 1185US8309454B2Structure for electrostatic discharge in embedded wafer level packagesBRUNNBAUER MARKUS·Filed 2007·Granted Nov 13, 2012·10 cites·14 claims
- 1281US8076784B2Stacked semiconductor chipsBRUNNBAUER MARKUS·Filed 2010·Granted Dec 13, 2011·5 cites·18 claims
- 1374US7211856B2Resistive memory for low-voltage applicationsINFINEON TECHNOLOGIES AG·Filed 2005·Granted May 1, 2007·4 cites·23 claims
- 1473US6884567B2Photosensitive formulation for buffer coatings, film containing the photosensitive formulation, and method for fabricating electronics with the photosensitive formulationINFINEON TECHNOLOGIES AG·Filed 2002·Granted Apr 26, 2005·11 cites·18 claims
- 1573US6437178B2O-aminophenolcarboxylic acid and o-aminothiophenolcarboxylic acidINFINEON TECHNOLOGIES AG·Filed 2001·Granted Aug 20, 2002·5 cites·13 claims
- 1672US7238964B2Memory cell, method for the production thereof and use of a composition thereforINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jul 3, 2007·4 cites·21 claims
- 1772US6531632B2Bis-o-aminophenols and o-aminophenolcarboxylic acids and process for preparing the sameINFINEON TECHNOLOGIES AG·Filed 2001·Granted Mar 11, 2003·6 cites·16 claims
- 1870US7022582B2Microelectronic process and structureINFINEON TECHNOLOGIES AG·Filed 2003·Granted Apr 4, 2006·12 cites·20 claims
- 1970US5556812AConnection and build-up technique for multichip modulesSIEMENS AG·Filed 1995·Granted Sep 17, 1996·40 cites·20 claims
- 2068US7064176B2Coating material for electronic componentsINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 20, 2006·8 cites·36 claims
- 2168US6866980B2Bis-o-aminophenol derivatives, poly-o-hydroxyamides, and polybenzoxazoles, usable in photosensitive compositions, dielectrics, buffer coatings, and microelectronicsINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 15, 2005·4 cites·22 claims
- 2267US7952200B2Semiconductor device including a copolymer layerINFINEON TECHNOLOGIES AG·Filed 2008·Granted May 31, 2011·2 cites·9 claims
- 2367US7746683B2NOR and NAND memory arrangement of resistive memory elementsQIMONDA AG·Filed 2007·Granted Jun 29, 2010·6 cites·6 claims
- 2464US5922825APreparation of poly-o-hydroxyamides and poly o-mercaptoamidesSIEMENS AG·Filed 1996·Granted Jul 13, 1999·18 cites·4 claims
- 2563US7052936B2Use of polybenzoxazoles (PBOS) for adhesionINFINEON TECHNOLOGIES AG·Filed 2002·Granted May 30, 2006·3 cites·24 claims
- 2663US6153350APolybenzoxazole and polybenzothiazole precursorsSIEMENS AG·Filed 1998·Granted Nov 28, 2000·23 cites·16 claims
- 2763US6110637APhotoresists which are suitable for producing sub-micron size structuresSIEMENS AKTINEGESELLSCHAFT·Filed 1995·Granted Aug 29, 2000·22 cites·20 claims
- 2863US5973202APreparation of poly-o-hydroxyamides and poly o-mercaptoamidesSIEMENS AG·Filed 1996·Granted Oct 26, 1999·24 cites·10 claims
- 2962US6037043AUV-hardenable and thermally hardenable epoxy resins for underfilling electrical and electronic componentsSIEMENS AG·Filed 1997·Granted Mar 14, 2000·24 cites·7 claims
- 3061US6787244B2Adhesively bonded chip-and wafer stacksINFINEON TECHNOLOGIES AG·Filed 2002·Granted Sep 7, 2004·10 cites·32 claims
- 3160US7867878B2Stacked semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jan 11, 2011·1 cites·12 claims
- 3260US5883221ASynthesis of polybenzoxasole and polybenzothiazole precursorsSIEMENS AG·Filed 1997·Granted Mar 16, 1999·18 cites·20 claims
- 3359US6861560B2Bis-o-aminophenols and processes for producing bis-o-aminophenolsINFINEON TECHNOLOGIES AG·Filed 2003·Granted Mar 1, 2005·2 cites·11 claims
- 3459US6824642B2Phenyl-linked oxazole cyanates as dielectrics having good adhesive and filling propertiesINFINEON TECHNOLOGIES AG·Filed 2002·Granted Nov 30, 2004·4 cites·22 claims
- 3559US6120970APolybenzoxazole and polybenzothiazole precursorsSIEMENS AG·Filed 1998·Granted Sep 19, 2000·15 cites·15 claims
- 3658US6806344B2Poly-o-hydroxamide, polybenzoxazole, and electronic component including a dielectric having a barrier effect against copper diffusion, and processes for preparing poly-o-hydroxyamides, polybenzoxazoles, and electronic componentsINFINEON TECHNOLOGIES AG·Filed 2003·Granted Oct 19, 2004·6 cites·15 claims
- 3756US7125814B2Bis-o-nitrophenols derivatives and poly-o-hydroxyamides, polybenzoxazoles, materials, and microelectronic devices made therefromINFINEON TECHNOLOGIES AG·Filed 2002·Granted Oct 24, 2006·1 cites·19 claims
- 3855US9601475B2Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chipsINTEL DEUTSCHLAND GMBH·Filed 2016·Granted Mar 21, 2017·0 cites·20 claims
- 3955US6861479B2Composition and process for the production of a porous layer using the compositionINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 1, 2005·4 cites·10 claims
- 4054US9093322B2Semiconductor deviceMEYER THORSTEN·Filed 2007·Granted Jul 28, 2015·1 cites·17 claims
- 4154US5384220AProduction of photolithographic structuresSIEMENS AG·Filed 1991·Granted Jan 24, 1995·16 cites·12 claims
- 4253US7244803B2Poly-o-hydroxyamide, polybenzoxazole from the poly-o-hydroxyamide, electronic component including a polybenzoxazole, and processes for producing the sameINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jul 17, 2007·2 cites·13 claims
- 4353US6635410B2Metallizing method for dielectricsINFINEON TECHNOLOGIES AG·Filed 2002·Granted Oct 21, 2003·2 cites·7 claims
- 4453US6150558ABis-o-amino(thio)phenols, and their preparationSIEMENS AG·Filed 1998·Granted Nov 21, 2000·5 cites·8 claims
- 4553US2014357075A1Semiconductor deviceMEYER THORSTEN·Filed 2014·Application pending·0 cites
- 4652US7273821B2Method for producing a porous coatingINFINEON TECHNOLOGIES AG·Filed 2002·Granted Sep 25, 2007·3 cites·39 claims
- 4752US7070904B2Polybenzoxazoles from poly-o-hydroxyamide, novel poly-o-hydroxyamides, preparation processes therefor, and their application in microelectronicsINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jul 4, 2006·1 cites·18 claims
- 4852US5262283AMethod for producing a resist structureSIEMENS AG·Filed 1991·Granted Nov 16, 1993·11 cites·20 claims
- 4952US5229258AMethod for producing a resist structureSIEMENS AG·Filed 1991·Granted Jul 20, 1993·11 cites·20 claims
- 5052US5194629AProcess for producing n-tertiary butoxycarbonyl-maleinimideSIEMENS AG·Filed 1991·Granted Mar 16, 1993·4 cites·8 claims
Showing the top 50 of 97 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →