Inventor
REBOH SHAY
FR66 patents
⚠️ This page may combine multiple inventors who share the name “REBOH SHAY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
COMMISSARIAT ENERGIE ATOMIQUE
42 patentsUS11081547B2Aug 3, 2021
Method for making superimposed transistors
COMMISSARIAT ENERGIE ATOMIQUE8 citations84
US10263077B1Apr 16, 2019
Method of fabricating a FET transistor having a strained channel
COMMISSARIAT ENERGIE ATOMIQUE12 citations84
US10217849B2Feb 26, 2019
Method for making a semiconductor device with nanowire and aligned external and internal spacers
COMMISSARIAT ENERGIE ATOMIQUE7 citations83
US10896956B2Jan 19, 2021
Field effect transistor with reduced contact resistance
COMMISSARIAT ENERGIE ATOMIQUE5 citations73
US10600786B2Mar 24, 2020
Method for fabricating a device with a tensile-strained NMOS transistor and a uniaxial compression strained PMOS transistor
COMMISSARIAT ENERGIE ATOMIQUE2 citations73
US10431683B2Oct 1, 2019
Method for making a semiconductor device with a compressive stressed channel
COMMISSARIAT ENERGIE ATOMIQUE3 citations73
US10269930B2Apr 23, 2019
Method for producing a semiconductor device with self-aligned internal spacers
COMMISSARIAT ENERGIE ATOMIQUE6 citations73
US10217842B2Feb 26, 2019
Method for making a semiconductor device with self-aligned inner spacers
COMMISSARIAT ENERGIE ATOMIQUE3 citations73
US10205021B1Feb 12, 2019
Method of fabrication of a semiconductor substrate having at least a tensilely strained semiconductor portion
COMMISSARIAT ENERGIE ATOMIQUE4 citations73
US10141424B2Nov 27, 2018
Method of producing a channel structure formed from a plurality of strained semiconductor bars
COMMISSARIAT ENERGIE ATOMIQUE2 citations73
US10134875B2Nov 20, 2018
Method for fabricating a transistor having a vertical channel having nano layers
COMMISSARIAT ENERGIE ATOMIQUE5 citations73
US10109735B2Oct 23, 2018
Process for fabricating a field effect transistor having a coating gate
COMMISSARIAT ENERGIE ATOMIQUE2 citations73
US10014183B2Jul 3, 2018
Method for patterning a thin film
COMMISSARIAT ENERGIE ATOMIQUE2 citations73
US9876121B2Jan 23, 2018
Method for making a transistor in a stack of superimposed semiconductor layers
COMMISSARIAT ENERGIE ATOMIQUE4 citations73
US9502558B2Nov 22, 2016
Local strain generation in an SOI substrate
COMMISSARIAT ENERGIE ATOMIQUE4 citations73
US9431538B2Aug 30, 2016
Enhanced method of introducing a stress in a transistor channel by means of sacrificial sources/drain regions and gate replacement
COMMISSARIAT ENERGIE ATOMIQUE5 citations73
US10347721B2Jul 9, 2019
Method to increase strain in a semiconductor region for forming a channel of the transistor
COMMISSARIAT ENERGIE ATOMIQUE2 citations72
US9704709B2Jul 11, 2017
Method for causing tensile strain in a semiconductor film
COMMISSARIAT ENERGIE ATOMIQUE2 citations72
US11469137B2Oct 11, 2022
Manufacturing process of an RF-SOI trapping layer substrate resulting from a crystalline transformation of a buried layer
COMMISSARIAT ENERGIE ATOMIQUE2 citations71
US10147818B2Dec 4, 2018
Enhanced method of stressing a transistor channel zone
COMMISSARIAT ENERGIE ATOMIQUE2 citations71
US9966453B2May 8, 2018
Method for doping source and drain regions of a transistor by means of selective amorphisation
COMMISSARIAT ENERGIE ATOMIQUE3 citations71
US9935019B2Apr 3, 2018
Method of fabricating a transistor channel structure with uniaxial strain
COMMISSARIAT ENERGIE ATOMIQUE2 citations71
US9343375B2May 17, 2016
Method for manufacturing a transistor in which the strain applied to the channel is increased
COMMISSARIAT ENERGIE ATOMIQUE4 citations71
US9246006B2Jan 26, 2016
Recrystallization of source and drain blocks from above
COMMISSARIAT ENERGIE ATOMIQUE6 citations71
US10170621B2Jan 1, 2019
Method of making a transistor having a source and a drain obtained by recrystallization of semiconductor
COMMISSARIAT ENERGIE ATOMIQUE2 citations67
US10115590B2Oct 30, 2018
Manufacturing of silicon strained in tension on insulator by amorphisation then recrystallisation
COMMISSARIAT ENERGIE ATOMIQUE2 citations64
US12198940B2Jan 14, 2025
Method for modifying the strain state of a block of a semiconducting material
COMMISSARIAT ENERGIE ATOMIQUE0 citations62
US11515392B2Nov 29, 2022
Semiconductor divice having a carbon containing insulation layer formed under the source/drain
COMMISSARIAT ENERGIE ATOMIQUE0 citations62
US11450755B2Sep 20, 2022
Electronic device including at least one nano-object
COMMISSARIAT ENERGIE ATOMIQUE0 citations62
US11217446B2Jan 4, 2022
Method for fabricating an integrated circuit including a NMOS transistor and a PMOS transistor
COMMISSARIAT ENERGIE ATOMIQUE1 citations62
US11062951B2Jul 13, 2021
Method of manufacturing of a field effect transistor having a junction aligned with spacers
COMMISSARIAT ENERGIE ATOMIQUE0 citations62
US10818775B2Oct 27, 2020
Method for fabricating a field-effect transistor
COMMISSARIAT ENERGIE ATOMIQUE1 citations62
US11769687B2Sep 26, 2023
Method for layer transfer with localised reduction of a capacity to initiate a fracture
COMMISSARIAT ENERGIE ATOMIQUE0 citations60
US11508613B2Nov 22, 2022
Method of healing an implanted layer comprising a heat treatment prior to recrystallisation by laser annealing
COMMISSARIAT ENERGIE ATOMIQUE0 citations60
US10950491B2Mar 16, 2021
Method for transferring a useful layer
COMMISSARIAT ENERGIE ATOMIQUE0 citations60
US10553723B2Feb 4, 2020
Method for forming doped extension regions in a structure having superimposed nanowires
COMMISSARIAT ENERGIE ATOMIQUE1 citations60
US12327719B2Jun 10, 2025
Semiconductor substrate polishing method
COMMISSARIAT ENERGIE ATOMIQUE0 citations57
US11848191B2Dec 19, 2023
RF substrate structure and method of production
COMMISSARIAT ENERGIE ATOMIQUE0 citations57
US12027421B2Jul 2, 2024
Low-temperature method for transfer and healing of a semiconductor layer
COMMISSARIAT ENERGIE ATOMIQUE0 citations52
US11967633B2Apr 23, 2024
Method for fabricating a doped region of a microelectronic device
COMMISSARIAT ENERGIE ATOMIQUE0 citations52
US11942323B2Mar 26, 2024
Method for manufacturing a doped zone of a microelectronic device
COMMISSARIAT ENERGIE ATOMIQUE0 citations52
US11177371B2Nov 16, 2021
Transistor with superposed bars and double-gate structure
COMMISSARIAT ENERGIE ATOMIQUE0 citations52
IBM
5 patentsUS10714392B2Jul 14, 2020
Optimizing junctions of gate all around structures with channel pull back
IBM3 citations73
US12557627B2Feb 17, 2026
Stacked FET with bottom epi size control and wraparound backside contact
IBM0 citations62
US11575003B2Feb 7, 2023
Creation of stress in the channel of a nanosheet transistor
IBM0 citations60
US11049933B2Jun 29, 2021
Creation of stress in the channel of a nanosheet transistor
IBM0 citations60
US12588484B2Mar 24, 2026
Backside diffusion break
IBM0 citations59
COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENE ALT
1 patentCOMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT
1 patentSOITEC SILICON ON INSULATOR
1 patentShowing the top 50 of 66 patents by PatentIndex Score.