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Inventor

VADHAVKAR SAMEER S

US32 patents
⚠️ This page may combine multiple inventors who share the name “VADHAVKAR SAMEER S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

29 patents
US9768149B2Sep 19, 2017

Semiconductor device assembly with heat transfer structure formed from semiconductor material

MICRON TECHNOLOGY INC24 citations94
US9397078B1Jul 19, 2016

Semiconductor device assembly with underfill containment cavity

MICRON TECHNOLOGY INC24 citations93
US9691746B2Jun 27, 2017

Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths

MICRON TECHNOLOGY INC9 citations84
US9515002B2Dec 6, 2016

Bonding pads with thermal pathways

MICRON TECHNOLOGY INC6 citations84
US9337119B2May 10, 2016

Stacked semiconductor die assemblies with high efficiency thermal paths and associated systems

MICRON TECHNOLOGY INC10 citations84
US10916527B2Feb 9, 2021

Apparatuses and methods for semiconductor die heat dissipation

MICRON TECHNOLOGY INC1 citations73
US10580746B2Mar 3, 2020

Bonding pads with thermal pathways

MICRON TECHNOLOGY INC1 citations73
US10573612B2Feb 25, 2020

Bonding pads with thermal pathways

MICRON TECHNOLOGY INC1 citations73
US10541229B2Jan 21, 2020

Apparatuses and methods for semiconductor die heat dissipation

MICRON TECHNOLOGY INC2 citations73
US10163830B2Dec 25, 2018

Bonding pads with thermal pathways

MICRON TECHNOLOGY INC3 citations73
US9647167B2May 9, 2017

Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods

MICRON TECHNOLOGY INC2 citations73
US11081460B2Aug 3, 2021

Methods and systems for manufacturing pillar structures on semiconductor devices

MICRON TECHNOLOGY INC5 citations69
US9443744B2Sep 13, 2016

Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods

MICRON TECHNOLOGY INC2 citations63
US11776877B2Oct 3, 2023

Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths

MICRON TECHNOLOGY INC0 citations62
US11631630B2Apr 18, 2023

Pillar-last methods for forming semiconductor devices

MICRON TECHNOLOGY INC0 citations62
US11139258B2Oct 5, 2021

Bonding pads with thermal pathways

MICRON TECHNOLOGY INC0 citations62
US10957625B2Mar 23, 2021

Pillar-last methods for forming semiconductor devices

MICRON TECHNOLOGY INC1 citations62
US10079333B2Sep 18, 2018

Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods

MICRON TECHNOLOGY INC1 citations62
US11735549B2Aug 22, 2023

Methods and systems for manufacturing pillar structures on semiconductor devices

MICRON TECHNOLOGY INC0 citations59
US10770435B2Sep 8, 2020

Apparatuses and methods for semiconductor die heat dissipation

MICRON TECHNOLOGY INC0 citations52
US10748878B2Aug 18, 2020

Semiconductor device assembly with heat transfer structure formed from semiconductor material

MICRON TECHNOLOGY INC0 citations52
US10559551B2Feb 11, 2020

Semiconductor device assembly with heat transfer structure formed from semiconductor material

MICRON TECHNOLOGY INC0 citations52
US10541355B2Jan 21, 2020

Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods

MICRON TECHNOLOGY INC0 citations52
US10461061B2Oct 29, 2019

Apparatuses and methods for semiconductor die heat dissipation

MICRON TECHNOLOGY INC0 citations52
US10297577B2May 21, 2019

Semiconductor device assembly with heat transfer structure formed from semiconductor material

MICRON TECHNOLOGY INC0 citations52
US10163755B2Dec 25, 2018

Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths

MICRON TECHNOLOGY INC1 citations52
US9837396B2Dec 5, 2017

Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods

MICRON TECHNOLOGY INC0 citations52
US10784224B2Sep 22, 2020

Semiconductor devices with underfill control features, and associated systems and methods

MICRON TECHNOLOGY INC0 citations50
US10424553B2Sep 24, 2019

Semiconductor devices with underfill control features, and associated systems and methods

MICRON TECHNOLOGY INC0 citations50

VADHAVKAR SAMEER S

2 patents

LODESTAR LICENSING GROUP LLC

1 patent