Inventor

CHA GI-BON

KR9 patents

⚠️ This page may combine multiple inventors who share the name “CHA GI-BON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LG SEMICON CO LTD

4 patents

US6030858AFeb 29, 2000

Stacked bottom lead package in semiconductor devices and fabricating method thereof

LG SEMICON CO LTD30 citations91

US5861668AJan 19, 1999

Semiconductor package

LG SEMICON CO LTD30 citations91

US5854740ADec 29, 1998

Electronic circuit board with semiconductor chip mounted thereon, and manufacturing method therefor

LG SEMICON CO LTD44 citations91

US6399420B2Jun 4, 2002

Ultra high density integrated circuit BLP stack and method for fabricating the same

LG SEMICON CO LTD10 citations70

GOLD STAR ELECTRONICS

2 patents

US5428248AJun 27, 1995

Resin molded semiconductor package

GOLD STAR ELECTRONICS292 citations97

US5363279ANov 8, 1994

Semiconductor package for a semiconductor chip having centrally located bottom bond pads

GOLD STAR ELECTRONICS107 citations96

HYUNDAI ELECTRONICS IND

2 patents

US6242798B1Jun 5, 2001

Stacked bottom lead package in semiconductor devices

HYUNDAI ELECTRONICS IND27 citations91

USRE37413EOct 16, 2001

Semiconductor package for a semiconductor chip having centrally located bottom bond pads

HYUNDAI ELECTRONICS IND2 citations61

LG SEMICON LTD

1 patent

USRE36097EFeb 16, 1999

Semiconductor package for a semiconductor chip having centrally located bottom bond pads

LG SEMICON LTD0 citations51