Inventor · disambiguated record
Dong Pil Jung
Also filed as: JUNG DONG P · JUNG DONG PIL
4 granted patents·2 pending applications·204 citations·filing 2005–2008
82Inventor score
Top patents by PatentIndex Score
6 records- 0196US7700411B2Semiconductor device package and manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Apr 20, 2010·88 cites·10 claims
- 0296US7633170B2Semiconductor device package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Dec 15, 2009·71 cites·16 claims
- 0392US7166917B2Semiconductor package having passive component disposed between semiconductor device and substrateADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Jan 23, 2007·33 cites·18 claims
- 0484US7833837B2Chip scale package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Nov 16, 2010·12 cites·17 claims
- 0545US2008174013A1Semiconductor device package and manufacturing method thereofYANG JUN YOUNG·Filed 2008·Application pending·0 cites
- 0643US2006170096A1Chip scale package and method for manufacturing the sameYANG JUN Y·Filed 2005·Application pending·0 cites
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