Inventor
GUHA BISWAJEET
US108 patents
⚠️ This page may combine multiple inventors who share the name “GUHA BISWAJEET”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
43 patentsUS11855223B2Dec 26, 2023
Self-aligned gate endcap (SAGE) architectures with gate-all-around devices
INTEL CORP6 citations86
US11522048B2Dec 6, 2022
Gate-all-around integrated circuit structures having source or drain structures with epitaxial nubs
INTEL CORP6 citations86
US11367796B2Jun 21, 2022
Gate-all-around integrated circuit structures having asymmetric source and drain contact structures
INTEL CORP6 citations86
US11233152B2Jan 25, 2022
Self-aligned gate endcap (SAGE) architectures with gate-all-around devices
INTEL CORP6 citations86
US11342411B2May 24, 2022
Cavity spacer for nanowire transistors
INTEL CORP7 citations84
US12342612B2Jun 24, 2025
Neighboring gate-all-around integrated circuit structures having disjoined epitaxial source or drain regions
INTEL CORP2 citations75
US12272737B2Apr 8, 2025
Gate-all-around integrated circuit structures having adjacent structures for sub-fin electrical contact
INTEL CORP2 citations75
US11799009B2Oct 24, 2023
Gate-all-around integrated circuit structures having adjacent structures for sub-fin electrical contact
INTEL CORP4 citations75
US12002810B2Jun 4, 2024
Gate-all-around integrated circuit structures having depopulated channel structures using bottom-up approach
INTEL CORP5 citations74
US11527612B2Dec 13, 2022
Gate-all-around integrated circuit structures having vertically discrete source or drain structures
INTEL CORP6 citations74
US11908856B2Feb 20, 2024
Gate-all-around integrated circuit structures having devices with source/drain-to-substrate electrical contact
INTEL CORP5 citations73
US11862635B2Jan 2, 2024
Neighboring gate-all-around integrated circuit structures having disjoined epitaxial source or drain regions
INTEL CORP2 citations73
US11824116B2Nov 21, 2023
Gate-all-around integrated circuit structures having devices with channel-to-substrate electrical contact
INTEL CORP4 citations73
US11824107B2Nov 21, 2023
Wrap-around contact structures for semiconductor nanowires and nanoribbons
INTEL CORP2 citations73
US11799037B2Oct 24, 2023
Gate-all-around integrated circuit structures having asymmetric source and drain contact structures
INTEL CORP2 citations73
US11527640B2Dec 13, 2022
Wrap-around contact structures for semiconductor nanowires and nanoribbons
INTEL CORP3 citations73
US11450738B2Sep 20, 2022
Source/drain regions in integrated circuit structures
INTEL CORP3 citations73
US11430868B2Aug 30, 2022
Buried etch-stop layer to help control transistor source/drain depth
INTEL CORP2 citations73
US11398474B2Jul 26, 2022
Neighboring gate-all-around integrated circuit structures having disjoined epitaxial source or drain regions
INTEL CORP4 citations73
US11302790B2Apr 12, 2022
Fin shaping using templates and integrated circuit structures resulting therefrom
INTEL CORP3 citations73
US11251302B2Feb 15, 2022
Epitaxial oxide plug for strained transistors
INTEL CORP2 citations73
US11205715B2Dec 21, 2021
Self-aligned nanowire
INTEL CORP2 citations73
US11929396B2Mar 12, 2024
Cavity spacer for nanowire transistors
INTEL CORP2 citations72
US11404578B2Aug 2, 2022
Dielectric isolation layer between a nanowire transistor and a substrate
INTEL CORP3 citations72
US11869891B2Jan 9, 2024
Non-planar integrated circuit structures having mitigated source or drain etch from replacement gate process
INTEL CORP2 citations71
US11804523B2Oct 31, 2023
High aspect ratio source or drain structures with abrupt dopant profile
INTEL CORP3 citations71
US11043492B2Jun 22, 2021
Self-aligned gate edge trigate and finFET devices
INTEL CORP4 citations71
US11621354B2Apr 4, 2023
Integrated circuit structures having partitioned source or drain contact structures
INTEL CORP2 citations70
US12364002B2Jul 15, 2025
Integrated circuit structures having metal gates with tapered plugs
INTEL CORP2 citations69
US12328920B2Jun 10, 2025
Nanoribbon sub-fin isolation by backside Si substrate removal etch selective to source and drain epitaxy
INTEL CORP0 citations63
US12230721B2Feb 18, 2025
Gate-all-around integrated circuit structures having asymmetric source and drain contact structures
INTEL CORP0 citations63
US12211925B2Jan 28, 2025
Gate-all-around integrated circuit structures having oxide sub-fins
INTEL CORP0 citations63
US12014959B2Jun 18, 2024
Integrated nanowire and nanoribbon patterning in transistor manufacture
INTEL CORP0 citations63
US11749733B2Sep 5, 2023
FIN shaping using templates and integrated circuit structures resulting therefrom
INTEL CORP0 citations63
US11742410B2Aug 29, 2023
Gate-all-around integrated circuit structures having oxide sub-fins
INTEL CORP0 citations63
US11715775B2Aug 1, 2023
Self-aligned gate endcap (SAGE) architectures with gate-all-around devices having epitaxial source or drain structures
INTEL CORP0 citations63
US11705518B2Jul 18, 2023
Isolation schemes for gate-all-around transistor devices
INTEL CORP0 citations63
US11588052B2Feb 21, 2023
Sub-Fin isolation schemes for gate-all-around transistor devices
INTEL CORP1 citations63
US11355608B2Jun 7, 2022
Self-aligned gate endcap (SAGE) architectures with gate-all-around devices having epitaxial source or drain structures
INTEL CORP0 citations63
US11335807B2May 17, 2022
Isolation schemes for gate-all-around transistor devices
INTEL CORP0 citations63
US11164790B2Nov 2, 2021
Integrated nanowire and nanoribbon patterning in transistor manufacture
INTEL CORP0 citations63
US12426316B2Sep 23, 2025
Method of fabricating integrated circuits with fin trim plug structures having an oxidation catalyst layer surrounded by a recessed dielectric material
INTEL CORP0 citations62
US12419091B2Sep 16, 2025
Source electrode and drain electrode protection for nanowire transistors
INTEL CORP0 citations62
KEPLER COMPUTING INC
4 patentsUS12445134B1Oct 14, 2025
Diode connected non-linear input capacitors based majority gate
KEPLER COMPUTING INC0 citations63
US12563737B1Feb 24, 2026
Memory device fabrication through wafer bonding
KEPLER COMPUTING INC0 citations62
US12464730B2Nov 4, 2025
Method of forming capacitors through wafer bonding
KEPLER COMPUTING INC0 citations62
US12412611B1Sep 9, 2025
Time decoupled write operations for non-linear polar material based memory
KEPLER COMPUTING INC0 citations62
UNIV CORNELL
2 patentsLIPSON MICHAL
1 patentShowing the top 50 of 108 patents by PatentIndex Score.