US11804523B2ActiveUtilityA1

High aspect ratio source or drain structures with abrupt dopant profile

84
Assignee: INTEL CORPPriority: Sep 24, 2019Filed: Sep 24, 2019Granted: Oct 31, 2023
Est. expirySep 24, 2039(~13.2 yrs left)· nominal 20-yr term from priority
H10D 62/834H10D 62/292H10D 62/121H10D 30/6735H10D 30/6729H10D 30/62H10D 30/43H10D 30/014H10D 62/151H10D 84/853H10D 84/834H10D 30/6757H01L 29/0847H01L 29/0673H01L 29/1037H01L 29/167H01L 29/41733H01L 29/42392H01L 29/785B82Y 10/00
84
PatentIndex Score
3
Cited by
3
References
18
Claims

Abstract

Integrated circuit structures having source or drain structures with abrupt dopant profiles are described. In an example, an integrated circuit structure includes a vertical arrangement of horizontal nanowires. A gate stack is around the vertical arrangement of horizontal nanowires. A first epitaxial source or drain structure is at a first end of the vertical arrangement of horizontal nanowires. A second epitaxial source or drain structure is at a second end of the vertical arrangement of horizontal nanowires. The first and second epitaxial source or drain structures include silicon, phosphorous and arsenic, with an atomic concentration of phosphorous substantially the same as an atomic concentration of arsenic.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. An integrated circuit structure, comprising:
 a vertical arrangement of horizontal nanowires; 
 a gate stack around the vertical arrangement of horizontal nanowires; 
 a first epitaxial source or drain structure at a first end of the vertical arrangement of horizontal nanowires; and 
 a second epitaxial source or drain structure at a second end of the vertical arrangement of horizontal nanowires, the first and second epitaxial source or drain structures comprising silicon, phosphorous and arsenic, with an atomic concentration of phosphorous substantially the same as an atomic concentration of arsenic, wherein the first and second epitaxial source or drain structures have a depth of phosphorous substantially the same as a depth of arsenic. 
 
     
     
       2. The integrated circuit structure of  claim 1 , wherein the depth of phosphorous is within approximately 1 nanometer of the depth of arsenic. 
     
     
       3. The integrated circuit structure of  claim 1 , wherein the first and second source or drain structures have a resistivity of less than approximately 0.35 mOhm·cm. 
     
     
       4. The integrated circuit structure of  claim 1 , further comprising:
 first and second dielectric gate sidewall spacers along the first and second sides of the gate stack, respectively. 
 
     
     
       5. The integrated circuit structure of  claim 1 , further comprising:
 a first conductive contact on the first epitaxial source or drain structure; and 
 a second conductive contact on the second epitaxial source or drain structure. 
 
     
     
       6. An integrated circuit structure, comprising:
 a vertical arrangement of horizontal nanowires; 
 a gate stack around the vertical arrangement of horizontal nanowires; 
 a first epitaxial source or drain structure at a first end of the vertical arrangement of horizontal nanowires, the first epitaxial source or drain structure having a first portion extending laterally beyond the vertical arrangement of horizontal nanowires and having a second portion extending vertically above the vertical arrangement of horizontal nanowires, the second portion having a vertical thickness greater than a horizontal thickness of the first portion; and 
 a second epitaxial source or drain structure at a second end of the vertical arrangement of horizontal nanowires, the second epitaxial source or drain structure having a first portion extending laterally beyond the vertical arrangement of horizontal nanowires and having a second portion extending vertically above the vertical arrangement of horizontal nanowires, the second portion having a vertical thickness greater than a horizontal thickness of the first portion. 
 
     
     
       7. The integrated circuit structure of  claim 6 , wherein the first and second epitaxial source or drain structures comprise silicon, phosphorous and arsenic, with an atomic concentration of phosphorous substantially the same as an atomic concentration of arsenic. 
     
     
       8. The integrated circuit structure of  claim 6 , further comprising:
 first and second dielectric gate sidewall spacers along the first and second sides of the gate stack, respectively. 
 
     
     
       9. The integrated circuit structure of  claim 6 , further comprising:
 a first conductive contact on the first epitaxial source or drain structure; and 
 a second conductive contact on the second epitaxial source or drain structure. 
 
     
     
       10. A computing device, comprising:
 a board; and 
 a component coupled to the board, the component including an integrated circuit structure, comprising:
 a vertical arrangement of horizontal nanowires; 
 a gate stack around the vertical arrangement of horizontal nanowires; 
 a first epitaxial source or drain structure at a first end of the vertical arrangement of horizontal nanowires; and 
 a second epitaxial source or drain structure at a second end of the vertical arrangement of horizontal nanowires, the first and second epitaxial source or drain structures comprising silicon, phosphorous and arsenic, with an atomic concentration of phosphorous substantially the same as an atomic concentration of arsenic, wherein the first and second epitaxial source or drain structures have a depth of phosphorous substantially the same as a depth of arsenic. 
 
 
     
     
       11. The computing device of  claim 10 , further comprising:
 a memory coupled to the board. 
 
     
     
       12. The computing device of  claim 10 , further comprising:
 a communication chip coupled to the board. 
 
     
     
       13. The computing device of  claim 10 , further comprising:
 a camera coupled to the board. 
 
     
     
       14. The computing device of  claim 10 , further comprising:
 a battery coupled to the board. 
 
     
     
       15. The computing device of  claim 10 , further comprising:
 an antenna coupled to the board. 
 
     
     
       16. The computing device of  claim 10 , wherein the component is a packaged integrated circuit die. 
     
     
       17. The computing device of  claim 10 , wherein the component is selected from the group consisting of a processor, a communications chip, and a digital signal processor. 
     
     
       18. The computing device of  claim 10 , wherein the computing device is selected from the group consisting of a mobile phone, a laptop, a desk top computer, a server, and a set-top box.

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