Inventor

YANG DEOKKYUNG

KR50 patents

⚠️ This page may combine multiple inventors who share the name “YANG DEOKKYUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YANG DEOKKYUNG

STATS CHIPPAC PTE LTD

System-in-package with double-sided molding

Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same

Molded laser package with electromagnetic interference shield and method of making

Semiconductor device and method of forming a 3D interposer system-in-package module

Semiconductor device and method of forming a 3D integrated system-in-package module

Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same

Semiconductor device and method of forming a 3D interposer system-in-package module

Integrated circuit packaging system with shielding and method of manufacturing thereof

System-in-package with double-sided molding

Semiconductor device and method of forming an integrated SIP module with embedded inductor or package

System-in-package with double-sided molding

Semiconductor device and method of forming protrusion E-bar for 3D SIP

Integrated circuit packaging system with molded laser via interposer and method of manufacture thereof

Method and device for reducing metal burrs when sawing semiconductor packages

Semiconductor device and method of forming a 3D interposer system-in-package module

Method and device for reducing metal burrs when sawing semiconductor packages

Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same

Method and device for reducing metal burrs when sawing semiconductor packages

Integrated circuit packaging system with shielding and method of manufacture thereof

Integrated circuit packaging system with shielding and method of manufacture thereof

Molded laser package with electromagnetic interference shield and method of making

Molded laser package with electromagnetic interference shield and method of making

Semiconductor device and method of forming an integrated SiP module with embedded inductor or package

Semiconductor device and method of forming protrusion e-bar for 3D SiP

Semiconductor device and method of forming a 3D integrated system-in-package module

YOON IN SANG

Method of manufacturing an integrated circuit packaging system including lasering through encapsulant over interposer

Integrated circuit packaging system with molded laser via interposer and method of manufacture thereof

Semiconductor packaging system with an aligned interconnect and method of manufacture thereof

Interposer substrate designs for semiconductor packages

Integrated circuit package system with step mold recess

YANG DEOKKYUNG

Integrated circuit packaging system with stackable package and method of manufacture thereof

Integrated circuit packaging system with exposed conductor and method of manufacture thereof

Method of manufacturing integrated circuit packaging system with support structure

Integrated circuit packaging system with conductive pillars and method of manufacture thereof

Integrated circuit packaging system with dual side mold and method of manufacture thereof

STATS CHIPPAC LTD

Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof

Integrated circuit packaging system having an internal structure protrusion and method of manufacture thereof

Integrated circuit with step molded inner stacking module package in package system

Integrated circuit package-on-package system with central bond wires

PARK HYUNGSANG

Integrated circuit package system

Integrated circuit packaging system with package-on-package stacking and method of manufacture thereof

CHOI A LEAM

Integrated circuit packaging system with interposer and method of manufacture thereof

Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof

CHOI DAESIK

Semiconductor package system with through silicon via interposer

ROH YOUNGDAL

Integrated circuit packaging system with coreless substrate and method of manufacture thereof

KIM YOUNGCHUL

Integrated circuit packaging system with connection structure and method of manufacture thereof

SHIN HANGIL

Integrated circuit packaging system with package-on-package and method of manufacture thereof

KO WONJUN

Integrated circuit packaging system with dielectric support and method of manufacture thereof

KIM KYUNGHWAN

Methods of mitigating defects for semiconductor packages

HA JONG-WOO

Integrated circuit package system having cavity