Inventor

KATO HIDETO

JP101 patents

⚠️ This page may combine multiple inventors who share the name “KATO HIDETO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KATO HIDETO

SHINETSU CHEMICAL CO

Silphenylene-bearing polymer, photo-curable resin composition, patterning process, and substrate circuit protective film

Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting film

Resist lower layer film material and method for forming a pattern

Photosensitive resin composition

Silphenylene-containing photocurable composition, pattern formation method using same, and optical semiconductor element obtained using the method

Positive resist composition suitable for lift-off technique and pattern forming method

Micropatterning method

Positive resist composition suitable for lift-off technique and pattern forming method

Flame retardant epoxy resin compositions

Photosensitive resin composition comprising a polyimide precursor and a photosensitive diazoquinone

Polymer containing silphenylene and polyether structures

Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer

Wafer process body, wafer processing member, wafer processing temporary adhesive material, and method for manufacturing thin wafer

Polyimide resin soluble in aqueous alkaline solution, composition comprising the resin and cured coating prepared from the composition

Epoxy resin compositions

Positive resist composition and patterning process

Photo-curable resin composition, patterning process, and substrate protecting film

Resist composition and patterning process

Polyimide silicone resin, process for its production, and polyimide silicone resin composition

Colorless and transparent polyimidesilicone resin having thermosetting functional groups

Methacrylic acid ester

Novel organosilicon compound

Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate-protecting coat

Heat-curable photosensitive compositions

Polymers and positive resist compositions

Polymers, resist compositions and patterning method

Polymers and positive resist compositions

Photosensitive resin composition and making process

Radiation-sensitive resin composition

Polyimide resin composition

Photosensitive resin composition and a process for forming a patterned polyimide film using the same

Photosensitive resin composition and a process for forming a patterned polyimide film using the same

Curable resin, process for making and electronic part protective coating

Photosensitive polymer composition

Curable resin compositions and electronic part protective coatings

Semiconductor element protecting compositions

Polyimide resin solution compositions

Polyimide resin compositions

Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the same

Semiconductor device, making method, and laminate

Wafer processing laminate and method for processing wafer

Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer

Photo-curable resin composition, photo-curable dry film, patterning process, protective film, and electric/electronic part

Precursor composition capable of yielding a polyimidesilicone resin

SHIN ESTU CHEMICAL CO LTD

Resist lower layer film material and method for forming a pattern

SHIN ETSU CHEMICALS CO LTD

Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate protective coating

KS TECHNO CO LTD

Fence sensor

(unassigned)

Train detection device for railroad models and train crossing control apparatus utilizing the train detection device

ASAI SATOSHI

Photocurable dry film, method for preparing same, patterning method and film for protecting electric and electronic parts

TAKEDA TAKANOBU

Epoxy-containing polymer, photo-curable resin composition, patterning process, and electric/electronic part protective film