Inventor · disambiguated record
Hiep Xuan Nguyen
Also filed as: NGUYEN HIEP · NGUYEN HIEP X · NGUYEN HIEP XUAN
16 granted patents·5 pending applications·447 citations·filing 1998–2024
92Inventor score
Top patents by PatentIndex Score
21 records- 0193US7106273B1Antenna mounting apparatusSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Sep 12, 2006·230 cites·20 claims
- 0293US6594148B1Airflow systemCISCO TECH IND·Filed 2002·Granted Jul 15, 2003·151 cites·14 claims
- 0388US9698075B2Integration of backside heat spreader for thermal managementTEXAS INSTRUMENTS INC·Filed 2016·Granted Jul 4, 2017·5 cites·14 claims
- 0482US7682432B2Adhesion promotion in printed circuit boardsENTHONE·Filed 2007·Granted Mar 23, 2010·3 cites·39 claims
- 0581US7232478B2Adhesion promotion in printed circuit boardsENTHONE·Filed 2003·Granted Jun 19, 2007·16 cites·5 claims
- 0681US7016193B1High efficiency counter-flow shelf cooling systemCISCO TECH IND·Filed 2003·Granted Mar 21, 2006·36 cites·10 claims
- 0779US10186431B2Integrated circuit package mold assemblyTEXAS INSTRUMENTS INC·Filed 2018·Granted Jan 22, 2019·2 cites·14 claims
- 0877US9496198B2Integration of backside heat spreader for thermal managementTEXAS INSTRUMENTS INC·Filed 2014·Granted Nov 15, 2016·3 cites·9 claims
- 0973US8142840B2Adhesion promotion in printed circuit boardsOWEI ABAYOMI I·Filed 2007·Granted Mar 27, 2012·1 cites·21 claims
- 1067US11978709B2Integrated system-in-package with radiation shieldingTEXAS INSTRUMENTS INC·Filed 2022·Granted May 7, 2024·0 cites·23 claims
- 1165US12489075B2Enhanced mold compound thermal conductivityTEXAS INSTRUMENTS INC·Filed 2021·Granted Dec 2, 2025·0 cites·20 claims
- 1264US9040117B2Adhesion promotion in printed circuit boardsOWEI ABAYOMI I·Filed 2012·Granted May 26, 2015·0 cites·16 claims
- 1362US11362047B2Integrated system-in-package with radiation shieldingTEXAS INSTRUMENTS INC·Filed 2020·Granted Jun 14, 2022·0 cites·20 claims
- 1458US10573537B2Integrated circuit package mold assemblyTEXAS INSTRUMENTS INC·Filed 2019·Granted Feb 25, 2020·0 cites·19 claims
- 1558US2024355700A1Die-package interconnect to facilitate thermal conductionTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1657US2025246506A1Electronic device with thermally conductive material in semiconductor die trenchTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1755US2025218908A1Multi-die transformer power modulesTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1855US2025357243A1Semiconductor device package with dual-sided coolingTESLA INC·Filed 2023·Application pending·0 cites
- 1952US11404360B2Power module with enhanced heat dissipationTEXAS INSTRUMENTS INC·Filed 2020·Granted Aug 2, 2022·0 cites·21 claims
- 2048US2017103904A1Integrated circuit package mold assemblyTEXAS INSTRUMENTS INC·Filed 2015·Application pending·0 cites
- 2147US12021004B2Embedded lid for low cost and improved thermal performanceTEXAS INSTRUMENTS INC·Filed 2021·Granted Jun 25, 2024·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →