Inventor · disambiguated record
Yasuhiro Sugaya
Also filed as: SUGAYA YASUHIRO
48 granted patents·9 pending applications·2,428 citations·filing 1990–2019
99Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD44PANASONIC CORP4PANASONIC IP MAN CO LTD4SUGAYA YASUHIRO2ASAHI TOSHIYUKI1
Top patents by PatentIndex Score
57 records- 0199US6734542B2Component built-in module and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 11, 2004·347 cites·34 claims
- 0298US7294587B2Component built-in module and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Nov 13, 2007·64 cites·10 claims
- 0398US6784530B2Circuit component built-in module with embedded semiconductor chip and method of manufacturingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Aug 31, 2004·169 cites·11 claims
- 0498US6538210B2Circuit component built-in module, radio device having the same, and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Mar 25, 2003·211 cites·26 claims
- 0597US6975516B2Component built-in module and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Dec 13, 2005·110 cites·26 claims
- 0697US6489685B2Component built-in module and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Dec 3, 2002·111 cites·24 claims
- 0796US7134198B2Method for manufacturing electric element built-in module with sealed electric elementMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Nov 14, 2006·113 cites·22 claims
- 0895US7198996B2Component built-in module and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Apr 3, 2007·31 cites·2 claims
- 0995US7091593B2Circuit board with built-in electronic component and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Aug 15, 2006·72 cites·8 claims
- 1095US7018866B2Circuit component built-in module with embedded semiconductor chip and method of manufacturingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Mar 28, 2006·83 cites·15 claims
- 1195US6871396B2Transfer material for wiring substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Mar 29, 2005·69 cites·22 claims
- 1294US6965284B2Dielectric filter, antenna duplexerMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Nov 15, 2005·51 cites·44 claims
- 1394US6855892B2Insulation sheet, multi-layer wiring substrate and production processes thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Feb 15, 2005·62 cites·44 claims
- 1494US6798121B2Module with built-in electronic elements and method of manufacture thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Sep 28, 2004·80 cites·15 claims
- 1594US5352522AComposite material comprising metallic alloy grains coated with a dielectric substanceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1992·Granted Oct 4, 1994·109 cites·8 claims
- 1693US7341890B2Circuit board with built-in electronic component and method for manufacturing the sameMATSUSHITA IND CO LTD·Filed 2006·Granted Mar 11, 2008·28 cites·15 claims
- 1793US5183631AComposite material and a method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1990·Granted Feb 2, 1993·91 cites·14 claims
- 1892US6939738B2Component built-in module and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Sep 6, 2005·56 cites·3 claims
- 1991US7394663B2Electronic component built-in module and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jul 1, 2008·50 cites·15 claims
- 2090US6969945B2Surface acoustic wave device, method for manufacturing, and electronic circuit deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Nov 29, 2005·44 cites·23 claims
- 2190US6525921B1Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Feb 25, 2003·53 cites·16 claims
- 2290US5350628AMagnetic sintered composite materialMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1992·Granted Sep 27, 1994·58 cites·15 claims
- 2389US7141884B2Module with a built-in semiconductor and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Nov 28, 2006·43 cites·27 claims
- 2487US7246421B2Method for manufacturing surface acoustic wave deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jul 24, 2007·10 cites·13 claims
- 2587US6955948B2Method of manufacturing a component built-in moduleMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Oct 18, 2005·33 cites·19 claims
- 2686US7821795B2Multilayer wiring boardPANASONIC CORP·Filed 2006·Granted Oct 26, 2010·16 cites·8 claims
- 2785US7242823B2Optical transmission channel board, board with built-in optical transmission channel, and data processing apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jul 10, 2007·12 cites·8 claims
- 2885US7013561B2Method for producing a capacitor-embedded circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Mar 21, 2006·33 cites·14 claims
- 2985US6931725B2Circuit component built-in module, radio device having the same, and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Aug 23, 2005·30 cites·31 claims
- 3082US7187071B2Composite electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Mar 6, 2007·11 cites·7 claims
- 3181US7061100B2Semiconductor built-in millimeter-wave band moduleMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jun 13, 2006·35 cites·23 claims
- 3280US6936774B2Wiring substrate produced by transfer material methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Aug 30, 2005·17 cites·15 claims
- 3380US6885788B2Light-reception/emission device built-in module with optical and electrical wiring combined therein, method for producing the module and assembling member of the moduleMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Apr 26, 2005·25 cites·17 claims
- 3480US5238507AMagnetic materialMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1990·Granted Aug 24, 1993·35 cites·15 claims
- 3576US7180169B2Circuit component built-in module and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Feb 20, 2007·19 cites·18 claims
- 3675US10186479B2Semiconductor device, package, and vehiclePANASONIC IP MAN CO LTD·Filed 2017·Granted Jan 22, 2019·2 cites·25 claims
- 3771US7968800B2Passive component incorporating interposerPANASONIC CORP·Filed 2007·Granted Jun 28, 2011·5 cites·6 claims
- 3870US7888789B2Transfer material used for producing a wiring substratePANASONIC CORP·Filed 2005·Granted Feb 15, 2011·2 cites·13 claims
- 3970US7001662B2Transfer sheet and wiring board using the same, and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Feb 21, 2006·12 cites·6 claims
- 4066US9905501B2Semiconductor device, embedded capacitor unit, semiconductor package, and method of manufacturing embedded capacitor unitPANASONIC IP MAN CO LTD·Filed 2016·Granted Feb 27, 2018·1 cites·13 claims
- 4164US7248482B2Module with built-in circuit component and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jul 24, 2007·10 cites·6 claims
- 4263US7667977B2Mounting board, mounted body, and electronic equipment using the samePANASONIC CORP·Filed 2006·Granted Feb 23, 2010·2 cites·19 claims
- 4360US7136543B2Mount assembly, optical transmission line and photoelectric circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Nov 14, 2006·4 cites·18 claims
- 4455US6521069B1Green sheet and manufacturing method thereof, manufacturing method of multi-layer wiring board, and manufacturing method of double-sided wiring boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Feb 18, 2003·5 cites·9 claims
- 4552US7390692B2Semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Granted Jun 24, 2008·0 cites·24 claims
- 4651US6696139B2Green sheet and manufacturing method thereof, manufacturing method of multi-layer wiring board and manufacturing method of double-sided wiring boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Feb 24, 2004·3 cites·8 claims
- 4749US2006078669A1Transfer sheet and wiring board using the same, and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 4849US2007224735A1Optical transmission channel board, board with built-in optical transmission channel, and data processing apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2007·Application pending·0 cites
- 4947US7132756B2Semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Nov 7, 2006·1 cites·12 claims
- 5047US2014008104A1Resistance-formed substrate and method for manufacturing sameSUGAYA YASUHIRO·Filed 2013·Application pending·0 cites
Showing the top 50 of 57 patent records by PatentIndex Score.
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