Inventor

HUEMOELLER RONALD PATRICK

US128 patents

⚠️ This page may combine multiple inventors who share the name “HUEMOELLER RONALD PATRICK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUEMOELLER RONALD PATRICK

AMKOR TECHNOLOGY INC

Wafer level package and fabrication method

Electronic component package comprising fan-out traces

Flip chip bump structure and fabrication method

Electronic component package comprising fan-out and fan-in traces

Semiconductor package including top-surface terminals for mounting another semiconductor package

Buildup dielectric and metallization process and semiconductor package

Wafer level package and fabrication method

Method of manufacturing a semiconductor package

Integrated circuit substrate having laser-embedded conductive patterns and method therefor

Wafer level package and fabrication method

Wafer level package and fabrication method

Buildup dielectric layer having metallization pattern semiconductor package fabrication method

Ultra thin package and fabrication method

Two-sided fan-out wafer escape package

Wafer level package utilizing laser-activated dielectric material

Semiconductor package including a top-surface metal layer for implementing circuit features

Two-sided wafer escape package

Stacked embedded leadframe

Method for making an integrated circuit substrate having embedded passive components

Two-sided wafer escape package

Integrated circuit substrate having laser-exposed terminals

Semiconductor package having substrate with laser-formed aperture through solder mask layer

Semiconductor package including a top-surface metal layer for implementing circuit features

Embedded electronic component package

Semiconductor package including top-surface terminals for mounting another semiconductor package

Method for making an integrated circuit substrate having laser-embedded conductive patterns

Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns

Integrated circuit substrate having laminated laser-embedded circuit layers

Integrated circuit substrate having embedded wire conductors and method therefor

Embedded leadframe semiconductor package

Semiconductor device with tiered pillar and manufacturing method thereof

Semiconductor package with high routing density patch

Semiconductor device package and manufacturing method thereof

Method of fabricating an embedded circuit pattern

Substrate having stiffener fabrication method

Method for making an integrated circuit substrate having embedded back-side access conductors and vias

Semiconductor package and substrate having multi-level vias fabrication method

Semiconductor package and substrate having multi-level vias

Imprinted integrated circuit substrate and method for imprinting an integrated circuit substrate

Solderable injection-molded integrated circuit substrate and method therefor

Wafer level package and fabrication method

HUEMOELLER RONALD PATRICK

Shielded embedded electronic component substrate fabrication method and structure

Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns

Wafer level package and fabrication method

Multi-level circuit substrate fabrication method

Wafer level package and fabrication method

HINER DAVID JON

Method and system for backside dielectric patterning for wafer warpage and stress control

Through via connected backside embedded circuit features structure and method

Through via recessed reveal structure and method

DARVEAUX ROBERT FRANCIS

Electronic component package fabrication method and structure