Inventor · disambiguated record
Shin-Ping Hsu
Also filed as: HSU SHIN-PING
5 granted patents·2 pending applications·19 citations·filing 2009–2009
74Inventor score
Top patents by PatentIndex Score
7 records- 0174US7973397B2Package substrate having embedded semiconductor chip and fabrication method thereofUNIMICRON TECHNOLOGY CORP·Filed 2009·Granted Jul 5, 2011·7 cites·6 claims
- 0274US7908744B2Method for fabricating printed circuit board having capacitance componentsUNIMICRON TECHNOLOGY CORP·Filed 2009·Granted Mar 22, 2011·7 cites·13 claims
- 0359US8188379B2Package substrate structureHSU SHIN-PING·Filed 2009·Granted May 29, 2012·3 cites·18 claims
- 0453US8421213B2Package structureHSU SHIN-PING·Filed 2009·Granted Apr 16, 2013·2 cites·19 claims
- 0547US2010002406A1Circuit board having semiconductor chip embedded thereinPHOENIX PREC TECHNOLOGY CORP·Filed 2009·Application pending·0 cites
- 0643US8129829B2Package substrate having embedded photosensitive semiconductor chip and fabrication method thereofHSU SHIN-PING·Filed 2009·Granted Mar 6, 2012·0 cites·14 claims
- 0742US2010006331A1Printed Circuit Board With Embedded Semiconductor Component and Method for Fabricating the SameUNIMICRON TECHNOLOGY CORP·Filed 2009·Application pending·0 cites
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