Inventor

CHEN MENG-TSE

TW94 patents

⚠️ This page may combine multiple inventors who share the name “CHEN MENG-TSE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN MENG-TSE

TAIWAN SEMICONDUCTOR MFG CO LTD

Package-on-package structure including a thermal isolation material and method of forming the same

Package-on-package structure and method

3D package structure and methods of forming same

Methods of packaging semiconductor devices and packaged semiconductor devices

EMI Shielding structure in InFO package

Package structure and method for forming the same

Package on package structure and method for forming the same

Process for forming package-on-package structures

RDL-first packaging process

Semiconductor device having antenna on chip package and manufacturing method thereof

Package on package structure and method for forming the same

Method for manufacturing interconnect structure

EMI shielding structure in InFO package

Stud bump structure for semiconductor package assemblies

Package structure

Semiconductor device having antenna and manufacturing method thereof

Package on package structure and method for forming the same

Methods of packaging semiconductor devices and packaged semiconductor devices

Device package including molding compound having non-planar top surface around a die

Methods of packaging semiconductor devices and packaged semiconductor devices

Wafer-level molding chase design

Manufacturing method of interconnect structure

Device package with reduced thickness and method for forming same

Methods for forming fan-out package structure

Package on package bonding structure and method for forming the same

Package-on-package structure having polymer-based material for warpage control

Packages and methods for forming the same

Stacked dies with wire bonds and method

Interconnect structures for wafer level package and methods of forming same

Integrated fan-out package and manufacturing method thereof

Semiconductor bonding structures and methods

3D package structure and methods of forming same

Semiconductor bonding structures and methods

TAIWAN SEMICONDUCTOR MFG

Package on package bonding structure and method for forming the same

Packaging methods and packaged semiconductor devices

Process for forming package-on-package structures

Package on package bonding structure and method for forming the same

Semiconductor interconnect structure

Packaging methods and structures for semiconductor devices

CHEN MENG-TSE

Package-on-package structure having polymer-based material for warpage control

Semiconductor packages having polymer-containing substrates and methods of forming same

Process for forming packages

Stud bump structure for semiconductor package assemblies

Apparatus and methods for molded underfills in flip chip packaging

LIN CHIH-WEI

Packaging methods and structures for semiconductor devices

Process for forming package-on-package structures

YU CHEN-HUA

Package on package structures and methods for forming the same

Exposing connectors in packages through selective treatment

CHEN MENG TSE

Bump-on-trace packaging structure and method for forming the same

HUANG KUEI WEI

Packaging methods for semiconductor devices including forming trenches in workpiece to separate adjacent packaging substrates