Inventor
HUANG KENLIN
US8 patents
⚠️ This page may combine multiple inventors who share the name “HUANG KENLIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
WINBOND ELECTRONICS CORP
3 patentsUS7408212B1Aug 5, 2008
Stackable resistive cross-point memory with schottky diode isolation
WINBOND ELECTRONICS CORP103 citations96
US7186658B2Mar 6, 2007
Method and resulting structure for PCMO film to obtain etching rate and mask to selectively by inductively coupled plasma
WINBOND ELECTRONICS CORP11 citations80
US7172939B1Feb 6, 2007
Method and structure for fabricating non volatile memory arrays
WINBOND ELECTRONICS CORP5 citations55
HEADWAY TECHNOLOGIES INC
2 patentsAPPLIED MATERIALS INC
2 patentsUS6638874B2Oct 28, 2003
Methods used in fabricating gates in integrated circuit device structures
APPLIED MATERIALS INC7 citations71
US6635577B1Oct 21, 2003
Method for reducing topography dependent charging effects in a plasma enhanced semiconductor wafer processing system
APPLIED MATERIALS INC8 citations69