Inventor · disambiguated record
Jai Subramanian
Also filed as: SUBRAMANIAN JAI · SUBRAMANIAN JAI S · SUBRAMANIAN JAI SHANKAR
6 granted patents·4 pending applications·58 citations·filing 2001–2021
81Inventor score
Files withHONEYWELL INT INC3SOLERAS ADVANCED COATINGS BV2DUCKHAM ALAN1INDIUM CORP AMERICA1NANOFOIL CORP1
Top patents by PatentIndex Score
10 records- 0191US7810704B2Method for fabricating large dimension bonds using reactive multilayer joiningNANOFOIL CORP·Filed 2008·Granted Oct 12, 2010·32 cites·17 claims
- 0288US7354659B2Method for fabricating large dimension bonds using reactive multilayer joiningREACTIVE NANOTECHNOLOGIES INC·Filed 2006·Granted Apr 8, 2008·17 cites·17 claims
- 0386US7635076B2Method for fabricating large dimension bonds using reactive multilayer joiningINDIUM CORP AMERICA·Filed 2008·Granted Dec 22, 2009·7 cites·16 claims
- 0463US2009173626A1Method for fabricating temperature sensitive and sputter target assemblies using reactive multilayer joiningDUCKHAM ALAN·Filed 2008·Application pending·0 cites
- 0550US2023272520A1Manufacture and refill of sputtering targetsSOLERAS ADVANCED COATINGS BV·Filed 2021·Application pending·0 cites
- 0650US2023272519A1Dense targetSOLERAS ADVANCED COATINGS BV·Filed 2021·Application pending·0 cites
- 0749US7897437B2Thermal interconnect systems methods of production and uses thereofHONEYWELL INT INC·Filed 2007·Granted Mar 1, 2011·0 cites·15 claims
- 0842US7378730B2Thermal interconnect systems methods of production and uses thereofHONEYWELL INT INC·Filed 2004·Granted May 27, 2008·1 cites·21 claims
- 0942US6958536B2Microelectronic packages having rail along portion of lid peripheryHONEYWELL INT INC·Filed 2001·Granted Oct 25, 2005·1 cites·14 claims
- 1037US2004187309A1Methods of forming pluralities of microelectronic lidsFiled 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →